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Fast frame readout architecture for array sensors with integrated correlated double sampling system

  • US 6,697,108 B1
  • Filed: 12/30/1998
  • Issued: 02/24/2004
  • Est. Priority Date: 12/31/1997
  • Status: Expired due to Term
First Claim
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1. An integrated imaging chip, comprising:

  • a plurality of pixel circuits in an m row by n column array, said pixel circuits each comprising a photosensitive element coupled between a first node and one side of a power source, a first switch coupled between said first node and another side of said power source, and a first MOS transistor coupled by a source and a drain between said other side of said power source and one port of a second switch, a gate of said MOS transistor being connected to said first node, another port of said second switch being coupled to an output of the pixel circuit;

    a plurality of column readout circuits, each operatively connected to receive at an input pixel signals from said outputs of said pixel circuits of at least one respective column of said pixel circuits, said column readout circuits each comprising a first current source coupled between said input of said column readout circuit and said one side of said power source, a second MOS transistor, a first capacitor coupled between said input of said column readout circuit and a gate of said second MOS transistor, a third switch coupled between said gate of said second MOS transistor and said one side of said power source, a second current source coupled between said other side of said power source and a second node, said second MOS transistor being coupled by a source and a drain between said second node and said one side of said power source, and a second capacitor having a port coupled between said second node and one port of a fourth switch, another port of said fourth switch being coupled to an output port of said column readout circuit; and

    an output circuit operatively connected to receive at an input data signals from said outputs of each of said column readout circuits, said output circuit comprising a third MOS transistor coupled by a source and a drain between said one side of said power source and an output node of said output circuit, and having a gate coupled to said input of said output circuit, a third current source couDled between said other side of said power source and said output node of said output circuit, and a fifth switch coupled between said gate of said third MOS transistor and said one side of said power source;

    wherein said column readout circuits are thereby collectively configured to all perform, in parallel, sequentially correlated double sampling operations on pixel readout data, and then in succession, to serially provide respective analog outputs to said output circuit.

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