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Batch fabricated semiconductor thin-film pressure sensor and method of making same

  • US 6,700,174 B1
  • Filed: 09/25/1997
  • Issued: 03/02/2004
  • Est. Priority Date: 09/25/1997
  • Status: Expired due to Term
First Claim
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1. A pressure sensor comprising:

  • a semiconductor frame having an opening;

    a flexible membrane which extends over the semiconductor frame and over the opening of the semiconductor frame; and

    a first strain gage resistor formed over a portion of the membrane which extends over the opening of the semiconductor frame.

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