Programmable optical array

• US 6,711,046 B1
• Filed: 06/25/2001
• Issued: 03/23/2004
• Est. Priority Date: 06/25/2001
• Status: Active Grant

• Current Assignee: Micrel Incorporated (Microchip Technology Incorporated)
• Original Assignee: Micrel Incorporated (Microchip Technology Incorporated)
• Inventors: Alter, Martin
• Primary Examiner(s): LE, THONG QUOC
• Application Number:
  US09/891,740
• Time in Patent Office: 1,002 Days
• Field of Search: 365/115, 365/243, 365/234, 365/237
• US Class Current: 365/115
• CPC Class Codes: B01J 2219/00436 Maskless processes
• CPC Class Codes: B01J 2219/00441 using lasers
• CPC Class Codes: B01J 2219/00527 Sheets
• CPC Class Codes: B01J 2219/00585 Parallel processes
• CPC Class Codes: B01J 2219/0059 Sequential processes
• CPC Class Codes: B01J 2219/00596 Solid-phase processes
• CPC Class Codes: B01J 2219/00605 the compounds being directly bound or immobilised to solid supports
• CPC Class Codes: B01J 2219/00626 Covalent
• CPC Class Codes: B01J 2219/00659 Two-dimensional arrays
• CPC Class Codes: B01J 2219/00675 In-situ synthesis on the substrate
• CPC Class Codes: B01J 2219/00689 using computers
• CPC Class Codes: B01J 2219/00722 Nucleotides
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: C40B 40/06 Libraries containing nucleotides or polynucleotides, or derivatives thereof
• CPC Class Codes: C40B 50/14 Solid phase synthesis, i.e. wherein one or more library building blocks are bound to a solid support during library creation; Particular methods of cleavage from the solid support
• CPC Class Codes: C40B 60/14 for creating libraries
• CPC Class Codes: G11C 11/36 using diodes, e.g. as threshold elements , i.e. diodes assuming a stable ON-stage when driven above their threshold (S- or N-characteristic)
• CPC Class Codes: G11C 13/048 using other optical storage elements
• CPC Class Codes: G11C 17/16 using electrically-fusible links
• CPC Class Codes: G11C 7/005 with combined beam-and individual cell access

Abstract

Programmable semiconductor elements, such as zener diodes, are used in an optical array. In one embodiment, an array of zener diodes is formed on a substrate surface and selectively zapped (programmed) to create a reflective filament between anode and cathode contacts of the selected zener diodes. Light is then applied to the surface. The reflected (or transmitted) light pattern may be used for conveying optical information or exposing a photoresist layer. In one use of the array to selectively expose a photoresist layer, the array helps to determine which genes have been expressed in a BioChip. Devices other than zener diodes may also be programmed to create a reflective filament for optically conveying information, such as bipolar transistors, MOSFETS, and non-semiconductor devices. The reflective filament can be a portion of a fuse or anti-fuse.

Claims

1. An optical device comprising:

programmable elements formed on a surface of a substrate, said programmable elements capable of being selectively programmed to create a reflective filament pattern for reflecting radiation in a selected optical pattern; and

an address decoder on said substrate for selectively addressing said programmable elements for programming.

2. The optical device of claim 1 wherein said programmable elements are formed in a two dimensional array.

3. The optical device of claim 1 wherein each of said programmable elements has conductive contacts, and wherein said conductive contacts are selected from metals consisting of aluminum and aluminum alloys.

4. The optical device of claim 1 further comprising a package containing said substrate, said package having a window exposing said programmable elements, said package having conductive terminals for programming said programmable elements.

5. The optical device of claim 1 wherein said selected optical pattern is an optical image.

6. The optical device of claim 1 wherein said selected optical pattern is an optical code.

7. The optical device of claim 1 wherein said selected optical pattern is a pattern for exposing photosensitive material.

8. The optical device of claim 1 wherein said programmable elements are diodes.

9. The optical device of claim 1 wherein said programmable elements are zener diodes.

10. The optical device of claim 1 wherein said programmable elements are transistors.

11. The optical device of claim 1 further comprising semiconductor regions over which are formed conductive contacts for each of said programmable elements.

12. The optical device of claim 1 wherein said substrate is a semiconductor substrate.

13. The optical device of claim 1 wherein said reflective filament pattern is both optically detectable, by detecting said optical pattern, and electrically detectable, by detecting electrical shorts between in said contacts reflective filament pattern.

14. The optical device of claim 1 wherein said programmable elements comprise normally-shorting conductive filaments between contact areas, said normally-shorting conductive filaments forming an open circuit between said contact areas when blown during programming.

15. A method for selectively reflecting light comprising:

providing programmable elements on a surface of a substrate;

programming said programmable elements to create a pattern of reflective filaments; and

applying radiation to said surface, such that radiation is reflected from said pattern of reflective filaments in a selected pattern.

16. The method of claim 15 wherein said selected pattern conveys optical information.

17. The method of claim 15 wherein said selected pattern is an optical image.

18. The method of claim 15 wherein said selected pattern is an optical code.

19. The method of claim 15 wherein said selected pattern is a pattern for exposing photosensitive material to light.

20. The method of claim 15, further comprising:

detecting a pattern of radiation that has passed through said substrate, said pattern of reflective filaments at least partially blocking said radiation from passing through said substrate.

21. The method of claim 15 wherein said programmable elements are diodes.

22. The method of claim 15 wherein said programmable elements are zener diodes.

23. The method of claim 15 wherein said programmable elements are transistors.

24. The method of claim 15 wherein each of said programmable elements are comprises a normally-shorting conductive filaments between two filament contact areas.

25. The method of claim 15 wherein said programmable elements are fuses.

26. The method of claim 15 wherein said programmable elements are anti-fuses.

27. An optical device comprising:

programmable elements formed on a surface of a substrate, said programmable elements capable of being selectively programmed to create a reflective filament pattern for reflecting radiation in a selected optical pattern; and

a read circuit electrically coupled to said programmable elements for reading said programmable elements after programming.

28. The optical device of claim 27 wherein said read circuit is formed on said substrate.

29. A device comprising one or more programmable elements, the one or more programmable elements being selectively programmable to create a reflective filament pattern for creating a selected optical pattern.

30. The device of claim 29, wherein each of the one or more programmable elements comprises:

a first contact; and

a second contact, wherein applying a programming current or a programming voltage across the first contact and the second contact of a selected one of the one or more programmable elements programs the selected one of the one or more programmable elements.

31. The device of claim 30, wherein the first contact and the second contact in each of the one or more programmable elements are formed of metal, and wherein applying the programming current or the programming voltage across the first contact and the second contact causes migration of the metal between the first contact and the second contact to form at least one reflective filament.

32. The device of claim 31, wherein the at least one reflective filament comprises a single reflective filament connecting the first contact to the second contact.

33. The device of claim 31, wherein the at least one reflective filament comprises a first reflective filament extending from the first contact, wherein the first reflective filament does not provide an electrical short between the first contact and the second contact.

34. The device of claim 31, wherein the metal comprises aluminum or an aluminum alloy.

35. The device of claim 31, wherein each of the one or more programmable elements comprises a diode.

36. The device of claim 35, wherein the diode comprises a zener diode.

37. The device of claim 35, wherein the diode comprises an avalanche diode.

38. The device of claim 31, wherein each of the one or more programmable elements comprises a transistor.

39. The device of claim 30, wherein each of the one or more programmable elements includes a reflective filament between the two contacts, and wherein applying the programming current or the programming voltage across the first contact and the second contact melts the reflective filament to create a gap in the reflective filament.

40. The device of claim 29, further comprising an address decoder for selectively addressing the one or more programmable elements for programming.

41. The device of claim 29, further comprising a read circuit electrically coupled to the one or more programmable elements for reading the reflective filament pattern.

42. The device of claim 29, wherein the selected optical pattern is formed by portions of an incident radiation beam reflected by the reflective filament pattern.

43. The device of claim 29, wherein the selected optical pattern is formed by portions of an incident radiation beam not reflected by the reflective filament pattern.

44. A method of conveying optical information, the method comprising:

providing an optical device programmed to include a plurality of reflective filaments forming a reflective filament pattern, the optical device comprising a first plurality of contact pairs and a second plurality of contact pairs, each of the first plurality of contact pairs being coupled by at least one of the plurality of reflective filaments, and none of the second plurality of contact pairs being coupled by any of the plurality of reflective filaments; and

directing radiation at the reflective filament pattern to generate an optical pattern, the optical pattern carrying the optical information.

45. The method of claim 44, wherein the first plurality of contact pairs and the second plurality of contact pairs are formed from metal on a semiconductor substrate, and wherein the plurality of reflective filaments are formed by metal migration between each of the first plurality of contact pairs.

46. The method of claim 45, wherein the metal comprises aluminum or an aluminum alloy.

47. The method of claim 44, wherein the first plurality of contact pairs and the second plurality of contact pairs form contacts for semiconductor devices.

48. The method of claim 44, wherein each of the first plurality of contact pairs forms contacts for an unblown fuse, and wherein each of the second plurality of contact pairs forms contacts for a blown fuse.

49. The method of claim 44, further comprising receiving the optical pattern to acquire the optical information.

50. The method of claim 49, wherein receiving the optical pattern comprises directing a portion of the optical pattern into an optical fiber.

51. The method of claim 49, wherein receiving the optical pattern comprises exposing a photosensitive layer with the optical pattern.

52. The method of claim 51, wherein the photosensitive layer comprises a photoresist layer on a semiconductor substrate.

53. The method of claim 51, wherein the photosensitive layer comprises a photosensitive chemical capping bonding sites on a DNA microarray.

54. The method of claim 44, wherein the optical pattern is formed by radiation reflected by the reflective filament pattern.

55. The method of claim 44, wherein the optical pattern is formed by radiation not reflected by the reflective filament pattern.

56. An optical assembly comprising:

an optical device programmed to include a plurality of reflective filaments forming a reflective filament pattern, the optical device comprising a first plurality of contact pairs and a second plurality of contact pairs, each of the first plurality of contact pairs being coupled by at least one of the plurality of reflective filaments, and none of the second plurality of contact pairs being coupled by any of the plurality of reflective filaments; and

a light source for directing light at the reflective filament pattern to generate an optical pattern.

57. The optical assembly of claim 56, further comprising at least one optical fiber for receiving the optical pattern from the optical device.

58. The optical assembly of claim 56, wherein the first plurality of contact pairs and the second plurality of contact pairs form contacts for a plurality of semiconductor devices.

59. The optical assembly of claim 58, wherein the semiconductor devices comprise zener diodes.

60. The optical assembly of claim 58, wherein the semiconductor devices comprise avalanche diodes.

61. The optical assembly of claim 58, wherein the semiconductor devices comprise transistors.

62. The optical assembly of claim 56, wherein each of the first plurality of contact pairs forms contacts for an unblown fuse, and wherein each of the second plurality of contact pairs forms contacts for a blown fuse.