Integrated device based upon semiconductor technology, in particular chemical microreactor

• US 6,727,479 B2
• Filed: 04/22/2002
• Issued: 04/27/2004
• Est. Priority Date: 04/23/2001
• Status: Expired due to Term

• Current Assignee: STMicroelectronics SRL (STMicroelectronics NV)
• Original Assignee: STMicroelectronics SRL (STMicroelectronics NV)
• Inventors: Villa, Flavio, Barlocchi, Gabriele, Mastromatteo, Ubaldo, Torchia, Manlio Gennaro
• Primary Examiner(s): PELHAM, JOSEPH MOORE
• Application Number:
  US10/128,989
• Publication Number:
  US 20030057199A1
• Time in Patent Office: 736 Days
• Field of Search: 219/200, 219/201, 219/385, 219/521, 219/530, 422/63, 422/81, 435/286.1, 435/286.5, 435/287.1, 435/287.2
• US Class Current: 219/521
• CPC Class Codes: B01J 19/0093 Microreactors, e.g. miniaturised or microfabricated reactors laboratory containers with capillary fluid transport in microfabricated channels or chambers B01L3/5027
• CPC Class Codes: B01J 2219/00783 Laminate assemblies, i.e. the reactor comprising a stack of plates
• CPC Class Codes: B01J 2219/00822 Metal
• CPC Class Codes: B01J 2219/00828 Silicon wafers or plates
• CPC Class Codes: B01J 2219/0086 Dimensions of the flow channels
• CPC Class Codes: B01J 2219/00873 Heat exchange
• CPC Class Codes: B01J 2219/00961 Temperature
• CPC Class Codes: B01J 2219/00986 Microprocessor
• CPC Class Codes: B01L 2300/1827 using resistive heater
• CPC Class Codes: B01L 2300/185 using a liquid as fluid
• CPC Class Codes: B01L 2300/1883 using thermal insulation
• CPC Class Codes: B01L 2300/1894 Cooling means; Cryo cooling
• CPC Class Codes: B01L 3/5027 by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip B01L3/5023 takes precedence; micromixers B01F33/30; microreactors for synthesis B01J19/0093; microcapillary devices in general B81B1/00
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B01L 7/525 with physical movement of samples between temperature zones

Abstract

An integrated device based upon semiconductor technology, in particular a chemical microreactor, including a semiconductor body having a high-temperature operating portion and a low-temperature operating portion. The semiconductor body is provided with a thermal-insulation device including a dissipator element arranged between the high-temperature operating portion and the low-temperature operating portion. The dissipator includes a membrane connecting the high-temperature operating portion and the low-temperature operating portion, and a plurality of diaphragms that extend substantially orthogonal to the membrane and are parallel to one another.

Claims

1. An integrated device comprising a semiconductor body having a high-temperature operating portion, a low-temperature operating portion, and thermal-insulation means, said thermal-insulation means including dissipator means arranged between said high-temperature operating portion and said low-temperature operating portion.

2. The device according to claim 1, wherein said dissipator means includes a membrane connecting said high-temperature operating portion and said low-temperature operating portion, and a plurality of diaphragms extending from said membrane.

3. The device according to claim 2, wherein said diaphragms are substantially orthogonal to said membrane and are parallel to one another.

4. The device according to claim 2 wherein said diaphragms are separated from one another and from said high-temperature operating portion by thermal-insulation trenches.

5. The device according to claim 2, further comprising a cooling chamber configured to contain a coolant and defined, beneath said membrane, between two adjacent diaphragms.

6. The device according to claim 5 wherein said cooling chamber is in fluid connection with a thermostatted reservoir through circulating means for circulating said coolant between said cooling chamber and said thermostatted reservoir.

7. The device according to claim 6 wherein said cooling chamber is arranged at least partially beneath said low-temperature operating portion.

8. The device according to claim 1, further comprising a first auxiliary dissipator and a second auxiliary dissipator respectively connected to said high-temperature operating portion and to said low-temperature operating portion.

9. The device according to claim 1 wherein the operating portions are configured for a chemical microreactor.

10. The device according to claim 9, further comprising a plurality of heating elements for heating said high-temperature operating portion, said heating elements being activated separately and independently by respective current sources.

11. The device according to claim 10, further comprising a plurality of temperature sensors supplying respective electrical temperature signals wherein said current sources are controlled current sources having respective control terminals receiving respective control signals correlated to said electrical temperature signals.

12. The device according to claim 9, further comprising at least one hydraulic circuit including:

at least one inlet opening;

at least one outlet duct ending onto an outlet reservoir; and

at least one buried channel extending inside said semiconductor body, parallel to and at a distance from a surface of said semiconductor body, said at least one buried channel being connected to said at least one inlet opening and to said at least one outlet duct.

13. The device according to claim 12 wherein said dissipator means are arranged beneath said at least one outlet duct.

14. An integrated device formed through microelectronic fabrication techniques, the integrated device comprising at least one microreactor, each of the at least one microreactors including:

a body having a first portion, a second portion, and a mid-portion positioned between the first and second portions;

a hydraulic circuit including;

an inlet for receiving a fluid;

a channel fluidly linked to the inlet and positioned in the first portion of the body;

an outlet fluidly linked to the channel; and

an outlet reservoir fluidly linked to the outlet;

a heating element positioned in the first portion of the body and thermally linked to the channel; and

a heat dissipator positioned in the mid-portion of the body and thermally linked to the outlet to substantially block propagation of heat from the heating element to the second portion of the body.

15. The integrated device of claim 14, further comprising an outlet heating element thermally linked to the outlet reservoir.

16. The integrated device of claim 14, further comprising a temperature sensor proximately located near the heating element.

17. The integrated device of claim 14 wherein the heat dissipator includes a membrane extending in the mid-portion of the body between the first and second portions.

18. The integrated device of claim 14 wherein the heat dissipator includes a plurality of diaphragms extending within the mid-portion of the body, the diaphragms separated from one another and separated from the first and second portions of the body by thermal-insulation trenches.

19. The integrated device of claim 18 wherein the diaphragms have a rectangular or trapezoidal cross-section.

20. The integrated device of claim 18 wherein the heat dissipator includes a membrane extending in the mid-portion of the body between the first and second portions and wherein the diaphragms structurally support the membrane.

21. The integrated device of claim 14, further comprising first and second dissipators connected to the first and second portions of the body, respectively.

22. The integrated device of claim 14, further comprising a protective layer overlying a surface of the body except for an opening above the outlet reservoir.

23. The integrated device of claim 14 wherein the heating element is electrically connected to a controlled current source.

24. The integrated device of claim 14, further including a thermostated reservoir wherein the heat dissipator includes a cooling chamber fluidly linked to the thermostated reservoir.

25. The integrated device of claim 14 wherein the inlet includes at least one of the following:

inlet openings and inlet reservoirs.

26. The integrated device of claim 14 wherein the outlet has an outlet duct.

27. The integrated device of claim 14 wherein the body is a semiconductor body.

29. The integrated device of claim 26 wherein the heat source is at least one of the following:

a micromotor and a micro-actuator.

30. The integrated device of claim 26, further comprising a heat sensitive device position in the second portion.

32. The integrated device of claim 29 wherein the heat sensitive device is at least one of the following:

an accelerometer and a pressure sensor.

28. An integrated device formed through microelectronic fabrication techniques, the integrated device comprising:

a body having a first portion, a second portion, and a mid-portion positioned between the first and second portions;

a heat source positioned in the first portion of the body; and

a heat dissipator positioned in the mid-portion of the body to substantially block propagation of heat from the at least one heat source to the second portion of the body.

31. The integrated device of claim 28 wherein the heat sensitive device is a sensing device.