Method of manufacturing a probe card
First Claim
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1. A method of making a probe card assembly comprising:
- providing a first component of said probe card assembly as a premanufactured component, said first component comprising a predetermined wiring pattern with contacts on a surface of said first component, thereafter receiving design data regarding a semiconductor device to be tested by said probe card assembly, said design data including locations of test points on said semiconductor device, adding one or more customization layers to said surface of said first component, adding a plurality of probes for contacting said test points on said semiconductor device to an outer one of said customization layers, said customization layers electrically connecting selected ones of said contacts on said surface of said first component with selected ones of said plurality of probes, and combining said first component with at least one other component to form said probe card assembly.
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Abstract
A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
217 Citations
24 Claims
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1. A method of making a probe card assembly comprising:
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providing a first component of said probe card assembly as a premanufactured component, said first component comprising a predetermined wiring pattern with contacts on a surface of said first component, thereafter receiving design data regarding a semiconductor device to be tested by said probe card assembly, said design data including locations of test points on said semiconductor device, adding one or more customization layers to said surface of said first component, adding a plurality of probes for contacting said test points on said semiconductor device to an outer one of said customization layers, said customization layers electrically connecting selected ones of said contacts on said surface of said first component with selected ones of said plurality of probes, and combining said first component with at least one other component to form said probe card assembly. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification