Heat sink

• US 6,738,257 B1
• Filed: 02/21/2003
• Issued: 05/18/2004
• Est. Priority Date: 12/02/2002
• Status: Active Grant

• Current Assignee: Tai-Sol Electronics Co., Ltd.
• Original Assignee: Aai-Sol Electronics
• Inventors: Lai, Yaw-Huey
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US10/369,566
• Publication Number:
  US 20040105235A1
• Time in Patent Office: 452 Days
• Field of Search: 361/699, 361/700, 361/704, 257/714, 257/715, 174/15.1, 174/15.2, 165/104.26, 165/80.4, 622/592
• US Class Current: 361/700
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28D 15/0283 Means for filling or sealing heat pipes
• CPC Class Codes: F28D 15/046 characterised by the material or the construction of the capillary structure
• CPC Class Codes: F28D 2021/0029 Heat sinks
• CPC Class Codes: F28F 1/32 the means having portions engaging further tubular elements

Abstract

An improved heat sink is composed of a base member, a cover member, at least one capillary layer, a plurality of hollow columns, a plurality of cooling fins, and a predetermined amount of solder. The base member is provided with an external wall extending upwards and outwards from a peripheral fringe thereof. The cover member is provided with a skirt portion extending downwards and outwards from a peripheral fringe thereof. A vapor chamber is formed between the cover member and the base member. The capillary layer, which is mounted in the vapor chamber, includes at least one plate member and a plurality of convex portions and is spaced apart from the skirt portion at a predetermined distance. The hollow columns are connected with tile cover member and communicate with the vapor chamber. Each of the hollow columns is fitted with a capillary pipe inside. A position in which an inner periphery of the hollow column contacts a top fringe of the internal wall is spaced apart from the capillary pipe at a predetermined distance. The cooling fins are fitted around an outer periphery of the hollow columns and are spaced apart from one another at a predetermined distance. The solder fills between the skirt portion and the base member and between bottoms of the hollow columns and the cover member.

Claims

1. A heat sink comprising:

a base cover having an external wall extending upwards and outwards from a peripheral fringe thereof;

a cover member having a skirt portion extending downwards and outwards from a peripheral fringe thereof, a plurality of through holes, and a plurality of internal walls respectively extending upwards from a peripheral fringe of said through hole, said cover member being mounted on said base member, said skirt portion being located within said external wall, a vapor chamber being defined between said base member and said cover member;

at least one capillary layer having at least one plate member and a plurality of convex portions located on said plate member, said capillary layer being mounted in said vapor chamber, said convex portions dividing said vapor chamber into a plurality of flow passages in communication with one another, said capillary layer being spaced apart from said skirt portion at a predetermined distance;

a plurality of hollow columns respectively having an opening at an end thereof and a capillary pipe fitted inside thereof, said hollow columns being identical to said through holes in numbers and being respectively fitted onto said internal wall at said opening thereof, each said capillary pipe having a bottom end extending into said vapor chamber and connected with said capillary layer, said capillary pipe having a plurality of pores at the bottom end thereof for intercommunicating said through holes and said flow passages, a position that an inner periphery of said hollow column contacts a top fringe of said internal wall being spaced apart from said capillary pipe at a predetermined distance;

a plurality of cooling fins fitted around outer peripheries of said hollow columns and spaced apart from one another at a predetermined distance; and

a predetermined amount of solder filling between said skirt portion and said base member and between said bottom sides of said hollow columns and said cover member.

2. The heat sink as defined in claim 1, wherein said hollow columns respectively have a bottom portion at a bottom side thereof, said bottom portion having a larger diameter than that of said through hole and an opening at a bottom side thereof, each said hollow column being fitted onto said internal wall at said opening thereof.

3. The heat sink as defined in claim 2, wherein each said hollow column includes a shoulder portion extending inwards and upwards from a top end thereof, a cap being mounted tightly on the top end of said hollow column, a space being formed between said cap and said shoulder portion;

wherein said solder fills between an inner periphery of said cap and an outer periphery of said hollow column.