Micromechanical tunable capacitor and an integrated tunable resonator

• US 6,744,335 B2
• Filed: 02/14/2001
• Issued: 06/01/2004
• Est. Priority Date: 02/16/2000
• Status: Active Grant

• Current Assignee: Nokia Technologies Oy (Nokia Corporation)
• Original Assignee: Nokia Mobile Phones UK Limited (Nokia Corporation)
• Inventors: Ermolov, Vladimir, Ryhänen, Tapani, Lind, Mikael, Silanto, Samuli
• Primary Examiner(s): Pascal, Robert
• Assistant Examiner(s): TAKAOKA, DEAN O
• Application Number:
  US09/783,059
• Publication Number:
  US 20020135440A1
• Time in Patent Office: 1,203 Days
• Field of Search: 334/80, 333/174, 333/101, 333/185, 333/219, 333/262, 361/278
• US Class Current: 333/185
• CPC Class Codes: H01G 5/16 using variation of distance between electrodes
• CPC Class Codes: H01G 5/40 Structural combinations of variable capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations
• CPC Class Codes: H03H 7/0115 comprising only inductors and capacitors H03H7/075, H03H7/09, H03H7/12, H03H7/13 take precedence

Abstract

An integrated tunable resonator for radio includes an RF resonator having a micromechanical tunable capacitor with high Q- (quality factor) value. A first conducting layer (4) forms the first capacitor electrode (8), and/or the electrodes (9) to create the electrostatic force on a movable micromechanical structure (2), and the interconnecting wire (10) between the inductor coil (1) and the capacitor electrode. This arrangement with the use of a dielectric insulating layer provides a substantial improvement to the linearity, power consumption, occupation space and reliability of RF resonator circuits.

Claims

1. An integrated tunable RF resonator comprising an integrated inductor and a micromechanical tunable capacitor connected in series or in parallel, comprising

a substrate (3),

a substrate insulating layer (5),

a first conducting layer (4) for forming a first capacitor electrode (8) and control electrodes (9) for applying a control voltage,

a second conducting layer (6) for forming a second capacitor electrode (11a, 11b) that is movable relative to the first capacitor electrode (8);

a third conducting layer for forming at least part of the inductor coil;

wherein said control electrodes (9) are used to create an electrostatic force on said movable second electrode (11) for tuning the capacitance of the capacitor,

characterized in that

a dielectric insulating layer (7) is used to at least partly cover said first capacitor electrode (8) to prevent the galvanic contact between said first capacitor electrode (8) and said second capacitor electrode (11),

wherein a portion of an exterior surface of said substrate (3) is at least partly removed at the location of the said inductor coil (1) and the said first capacitor electrode (8) and further wherein said substrate (3) is removed up to said first capacitor electrode or up to said substrate insulating layer (5)

said substrate insulating layer (5) is arranged as a suspended structure for the said first capacitor electrode (8) and the semiconductor coil (1).

2. An integrated tunable RF resonator according to claim 1, characterized in that said substrate insulating layer is between the substrate and the first conducting layer.

3. An integrated tunable RF resonator according to claim 1, characterized in that the first conducting layer forms an interconnecting wire between the inductor coil and the capacitor electrode.

4. A micromechanical tunable capacitor according to claim 1, characterized in that, the said substrate is a semiconductor material.

5. An integrated tunable RF resonator according to claim 1, characterized in that the dielectric insulating layer (7) is preventing the galvanic contact between the first conducting layer (8) and the second conducting layer (6).

6. An integrated tunable RF resonator according to claim 1, characterized in that a portion of said second conducting layer is used for forming at least part of the inductor coil.

7. An integrated tunable RF resonator, according to claim 1, characterized that the moveable second capacitor electrode is electrically connected to the same potential as the substrate.

8. An integrated tunable RF resonator according to claim 1, characterized in that, a gap between the capacitor electrodes is an air gap.

9. An integrated tunable RF resonator according to claim 8, characterized in that the dielectric insulating layer is used as a sacrificial layer in creating the air gap.

10. An integrated tunable RF resonator, according to claim 1, characterized in that the dielectric insulating layer is used as a sacrificial layer to create an air gap between said first capacitor electrode and said second capacitor electrode.

11. An integrated tunable RF resonator according to claim 1, characterised in that said dielectric insulating layer on top of said first capacitor electrode covers the electrode only partly.

12. An integrated tunable RF resonator according to claim 1, characterized in that the dielectric insulating layer on top of said first capacitor electrode is silicon nitride.

13. An integrated tunable RF resonator according to claim 1, characterized in that the dielectric insulating layer on top of said first capacitor electrode is polymer.

14. An integrated tunable RF resonator according to claim 1, characterized in that the second capacitor electrode is the ground electrode.

15. An integrated tunable RF resonator according to claim 1, characterized in that the third conducting layer is metal film.

16. An integrated tunable RF resonator according to claim 1, characterized in that the material of which the first conducting layer is constructed is selected from the group consisting of one of the following materials:

a refractory metal, selected from the group consisting of Mo, W or Tiw,

a metal, selected from the group consisting of Au or Cu, or

a doped electrode in bulk silicon.

17. An integrated tunable RF resonator according to claim 1, characterized in that the material of which the second conducting layer is constructed is selected from the group consisting of one of the following materials:

a metal, selected from the group consisting of Au or Cu,

polysilicon, or

monocrystalline silicon.

18. An integrated tunable RF resonator according to claim 1, characterized in that the third conducting layer is metal.

19. An integrated tunable RF resonator according to claim 1, characterized in that the third conducting layer is a electroplated layer with a substantially larger thickness than the thickness of the first and second conducting layers.

20. An integrated tunable RF resonator according to claim 1, characterized in that the inductor coil comprises an electroplated metal layer on top of the third conducting layer.

21. An integrated tunable RF resonator according to claim 1, characterized in that the inductor coil is arranged to be adjustable.

22. An integrated tunable RF resonator according to claim 1, characterized in that the inductor coil has several segments, and it is arranged to be adjustable by means to change the number of active segments in the coil.

23. An integrated tunable RF resonator according to claim 1, characterized in that the segments of the inductor coil are changed by a micro-electro-mechancial switch realized in the same fabrication process with capacitors and inductors.

24. An integrated tunable RF resonator according to claim 1, characterized in that the inductor coil is a planar inductor coil.

25. A micromechanical tunable capacitor according to claim 1, characterized in that, said second capacitor electrode is metal thin film.

26. A micromechanical tunable capacitor according to claim 1, characterized in that the second capacitor electrode is folded and/or corrugated to at least two levels with respect to the first capacitor electrode.

27. A micromechanical tunable AF resonator according to claim 26, characterized in that the vertical portions of the folds and/or corrugates are fabricated thinner than the lateral portions of the second capacitor electrode.

28. A micromechanical tunable capacitor, comprising at least of one counter electrode forming a first plate of the capacitor, and at least one active electrode and at least one tuning electrode forming a second capacitor plate, said plates separated by a dielectric gap characterized in that,

each of said electrodes is a metal film formed on a substrate (3),

at least one of the capacitor plates is arranged to be a flexible and elastic structure,

said electrodes on the other of said at least one capacitor plate is covered by an insulating layer (7) to prevent a galvanic contact between the said electrodes on the first and second capacitor plates;

and

wherein a portion of an exterior surface of said substrate (3) is at least partly removed at the location of said at least one active capacitor electrode (8), wherein said substrate (3) is removed up to said active capacitor electrode (8).

29. A micromechanical tunable capacitor according to claim 28, characterized in that the dielectric gap is arranged to be narrower between at least one active electrode and at least one counter electrode than between at least one tuning electrode and at least one counter electrode.

30. A micromechanical tunable capacitor according to claim 28, characterized in that said active electrode and said at least one tuning electrode are formed in the same layer.

31. A micromechanical tunable capacitor according to claim 28, characterized in that said capacitor plate having a flexible and elastic structure is electrically connected to the same potential as the substrate.

32. A micromechanical tunable capacitor according to claim 28, characterized in that a tuning signal is arranged to be fed through the tuning electrode.

33. A micromechanical tunable capacitor according to claim 28, characterized in said flexible and elastic capacitor plate is clamped from two opposite sides and that the active electrode is arranged to be positioned further from said opposite sides than at least one tuning electrode.