Method for fabricating an isolated microelectromechanical system (MEMS) device incorporating a wafer level cap

• US 6,768,628 B2
• Filed: 04/26/2001
• Issued: 07/27/2004
• Est. Priority Date: 04/26/2001
• Status: Expired due to Term

• Current Assignee: Longitude Licensing Limited (Vector Capital Corporation)
• Original Assignee: Rockwell Automation Technologies Incorporated (Allen-Bradley Co., Inc.)
• Inventors: Kretschmann, Robert J., Harris, Richard D., Lucak, Mark A., Knieser, Michael J.
• Primary Examiner(s): Reichard, Dean A.
• Assistant Examiner(s): THOMAS, ERIC W
• Application Number:
  US09/842,975
• Publication Number:
  US 20020159218A1
• Time in Patent Office: 1,188 Days
• Field of Search: 361/277, 361/278, 361/280, 361/281
• US Class Current: 361/277
• CPC Class Codes: B81B 2207/097 Interconnects arranged on the substrate or the lid, and covered by the package seal
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 1/00357 involving bonding one or several substrates on a non-temporary support, e.g. another substrate
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate

Abstract

A MEMS structure is provided having a cap that encapsulates and protects the fragile components of the device, while having an electrical trace embedded in a nonconductive substrate. The electrical trace includes a first terminal end that is exposed to the peripheral region of the device, and a second end that is connected to the MEMS structure to facilitate operation of the device.

Claims

1. A MEMS structure comprising:

a substrate;

at least one conductive element that is in mechanical communication with the substrate and that extends therefrom;

a movable MEMS element having a portion that is free from the substrate and positioned such that a gap separating the movable MEMS element from the at least one conductive element defines a variable-sized dimension extending substantially parallel to the substrate;

at least one electrical trace having a first terminal end in electrical communication with the at least one conductive element and a second terminal end in electrical communication with a peripheral region; and

a cap attached to the substrate inside the peripheral region having upper and side walls that encapsulate the at least one conductive element and the movable MEMS element.

2. The MEMS structure as recited in claim 1, wherein the cap is non-conductive.

3. The MEMS structure as recited in claim 2, wherein the cap is selected from the group consisting of glass, high resistivity silicon, crystalline sapphire, and ceramic.

4. The MEMS structure as recited in claim 1, wherein the cap is conductive.

5. The MEMS structure as recited in claim 4, wherein the cap is selected from the group consisting of silicon and metal.

6. The MEMS structure as recited in claim 1, wherein the at least one electrical trace is selected from the group consisting of doped polysilicon, and a metal.

7. The MEMS structure as recited in claim 6, wherein the metal is selected from the group consisting of tungsten, titanium, nickel, and alloys thereof, and aluminum, copper, silver, and gold.

8. The MEMS structure as recited in claim 1, wherein a bottom surface of at least one of the side walls of the cap is attached to the substrate.

9. The MEMS structure as recited in claim 1, wherein the sidewalls are connected to the substrate at a location between first and second terminal ends of the at least one electrical trace.

10. The MEMS structure as recited in claim 1, wherein the at least one electrical trace is disposed within an interface between the at least one conductive element and the substrate.

11. The MEMS structure as recited in claim 1, wherein the substrate comprises a nonconductive material.

12. The MEMS structure as recited in claim 11, wherein a portion of the at least one electrical trace is in electrical communication with the substrate.

13. The MEMS structure as recited in claim 1, wherein the substrate comprises a conductive material.

14. The MEMS structure as recited in claim 1, wherein the substrate further comprises a recess formed in the upper surface thereof.

15. The MEMS structure as recited in claim 14, wherein the movable MEMS element is disposed above and substantially aligned with the recess.

16. The MEMS structure as recited in claim 1, wherein the movable MEMS element comprises at least one conductive member attached to a nonconductive base.

17. The MEMS structure as recited in claim 16, wherein the nonconductive base is selectively etchable from the conductive member.

18. The MEMS structure as recited in claim 16 wherein the nonconductive base comprises one of silicon dioxide and silicon nitride.

19. The MEMS structure as recited in claim 1, wherein the substrate is selected from the group consisting of high resistivity silicon, crystalline sapphire, glass and ceramic.

20. The MEMS structure as recited in claim 1, wherein the substrate is selected from the group consisting of silicon, silicon carbide, gallium arsenide, and metal.

21. The MEMS structure as recited in claim 1, wherein the at least one conductive element is selected from the group consisting of silicon, silicon carbide, and gallium arsenide.

22. A MEMS structure disposed within a peripheral region comprising:

a substrate;

a movable MEMS element having outer ends permanently connected to the substrate, and a middle portion connected between the outer ends and free from the substrate;

a stationary conductive MEMS element in mechanical communication with the substrate and disposed adjacent the movable MEMS element, wherein a gap is disposed between the middle portion and the stationary conductive MEMS element, and wherein the gap defines a variable-sized dimension extending substantially parallel to the substrate; and

a cap attached to the substrate having upper and side walls that encapsulate the stationary conductive MEMS element and the movable MEMS element.

23. The MEMS structure as recited in claim 22, wherein the cap separates the MEMS structure from the peripheral region, the MEMS structure further comprising:

at least one electrical trace having a first terminal end in electrical communication with the stationary conductive MEMS element and a second terminal end in electrical communication with the peripheral region.

24. The MEMS structure as recited in claim 23, further comprising:

a second stationary MEMS element in mechanical communication with the substrate and disposed adjacent the movable MEMS element; and

a second electrical trace having a first terminal end in electrical communication with the second stationary MEMS element and a second terminal end in electrical communication with the peripheral region.

25. The MEMS structure as recited in claim 24, wherein the stationary MEMS elements are electrically isolated from each other.

26. The MEMS structure as recited in claim 22, wherein the movable MEMS element further comprises at least two conductive elements.

27. The MEMS structure as recited in claim 26, wherein the at least two conductive elements are electrically isolated from each other.

28. A MEMS structure surrounded by a peripheral region, the MEMS structure comprising:

a substrate;

at least one stationary conductive element that is in mechanical communication with the substrate;

a movable MEMS element disposed adjacent the at least one stationary conductive element, and having outer ends permanently connected to the substrate, and a middle portion connected between the outer ends and free from the substrate; and

at least one electrical trace having a first terminal end in electrical communication with the at least one stationary conductive element and a second terminal end in electrical communication with the peripheral region, wherein the at least one electrical trace is disposed within an electrically insulating interface between the at least one conductive MEMS element and the substrate.

29. The MEMS structure as recited in claim 28, further comprising a cap attached to the substrate inside the peripheral region having upper walls and side walls that encapsulate the at least one stationary element and the movable MEMS element.

30. The MEMS structure as recited in claim 29, wherein the second terminal extends outside the cap.

31. A MEMS structure surrounded by a peripheral region, the MEMS structure comprising:

a substrate extending along a lateral direction;

first and second stationary conductive elements in mechanical communication with the substrate;

a movable MEMS element disposed laterally adjacent the stationary conductive elements, and having outer ends permanently connected to the substrate, and a middle portion connected between the outer ends and free from the substrate; and

first and second electrical traces having first terminal ends in electrical communication with the first and second stationary elements, respectively, and having second terminal ends in electrical communication with the peripheral region, wherein each trace is disposed within an electrically insulating interface between the substrate and the stationary conductive elements.

32. The MEMS structure as recited in claim 31, further comprising a cap attached to the substrate inside the peripheral region having upper walls and side walls that encapsulate the stationary conductive elements and the movable MEMS element.

33. The MEMS structure as recited in claim 32, wherein the second terminal ends extend outside the cap.

34. The MEMS structure as recited in claim 33, wherein the second terminal ends are electrically isolated from each other.

35. The MEMS structure as recited in claim 31, wherein the movable MEMS element further comprises at least two conductive elements.

36. The MEMS structure as recited in claim 35, wherein the at least two conductive elements are electrically isolated from each other.

37. A MEMS structure comprising:

a substrate;

at least one conductive element that is in mechanical communication with the substrate and that extends therefrom;

a movable MEMS element having a portion that is free from the substrate and positioned such that a gap separates the movable MEMS element from the at least one conductive element;

at least one electrical trace having a first terminal end in electrical communication with the at least one conductive element and a second terminal end in electrical communication with a peripheral region; and

a cap attached to the substrate inside the peripheral region having upper and side walls that encapsulate the at least one conductive element and the movable MEMS element,

wherein the at least one electrical trace is disposed within an electrically insulating interface between the at least one conductive MEMS element and the substrate.

38. The MEMS structure as recited in claim 37 wherein the interface prevents any portion of the at least one electrical trace from being in electrical communication with the substrate.

39. The MEMS structure as recited in claim 37 wherein the interface layer comprises one of silicon dioxide and silicon nitride.

40. The MEMS structure as recited in claim 37 wherein the movable MEMS element has outer ends permanently connected to the substrate, wherein the portion free from the substrate is connected between the outer ends.

41. The MEMS structure as recited in claim 37 wherein the gap defines a variable-sized dimension that extends substantially parallel to the substrate.

42. A MEMS structure comprising:

a substrate;

at least one stationary conductive element that is in mechanical communication with the substrate and that extends therefrom;

a movable MEMS element having outer ends permanently connected to the substrate and a middle portion connected between the outer ends that is free from the substrate and positioned such that a gap separates the movable MEMS element from the at least one conductive element, wherein the gap defines a variable-sized dimension extending substantially parallel to the substrate;

at least one electrical trace having a first terminal end in electrical communication with the at least one stationary conductive element and a second terminal end in electrical communication with a peripheral region; and

a cap attached to the substrate inside the peripheral region having upper and side walls that encapsulate the at least one stationary conductive element and the movable MEMS element.

43. The MEMS structure as recited in claim 42, wherein the electrical trace is disposed within an electrically insulating layer between the stationary conductive element and the substrate.

44. The MEMS structure as recited in claim 42, wherein the cap is non-conductive.

45. The MEMS structure as recited in claim 44, wherein the cap is selected from the group consisting of glass, high resistivity silicon, crystalline sapphire, and ceramic.

46. The MEMS structure as recited in claim 42, wherein the cap is conductive.

47. The MEMS structure as recited in claim 46 wherein the cap is selected from the group consisting of silicon and metal.

48. The MEMS structure as recited in claim 42, wherein the electrical trace is selected from the group consisting of doped polysilicon, and a metal.

49. The MEMS structure as recited in claim 48, wherein the metal is selected from the group consisting of tungsten, titanium, nickel, and alloys thereof, and aluminum, copper, silver, and gold.

50. The MEMS structure as recited in claim 42, wherein a bottom surface of at least one of the side walls of the cap is attached to the substrate.

51. The MEMS structure as recited in claim 42, wherein the sidewalls are connected to the substrate at a location between first and second terminal ends of the at least one electrical trace.

52. The MEMS structure as recited in claim 42 wherein the substrate comprises a nonconductive material.

53. The MEMS structure as recited in claim 52, wherein a portion of the at least one electrical trace is in electrical communication with the substrate.

54. The MEMS structure as recited in claim 42, wherein the substrate comprises a conductive material.

55. The MEMS structure as recited in claim 42, wherein the substrate further comprises a recess formed in the upper surface thereof.

56. The MEMS structure as recited in claim 55, wherein the movable MEMS element is disposed above and substantially aligned with the recess.

57. The MEMS structure as recited in claim 42, wherein the movable MEMS element comprises at least one conductive member attached to a nonconductive base.

58. The MEMS structure as recited in claim 57, wherein the nonconductive base is selectively etchable from the conductive member.

59. The MEMS structure as recited in claim 57 wherein the nonconductive base comprises one of silicon dioxide and silicon nitride.

60. The MEMS structure as recited in claim 42, wherein the substrate is selected from the group consisting of high resistivity silicon, crystalline sapphire, glass and ceramic.

61. The MEMS structure as recited in claim 42 wherein the substrate is selected from the group consisting of silicon, silicon carbide, gallium arsenide, and metal.

62. The MEMS structure as recited in claim 42, wherein the at least one conductive element is selected from the group consisting of silicon, silicon carbide, and gallium arsenide.

63. A MEMS structure disposed within a peripheral region comprising:

a substrate;

a stationary element extending from the substrate;

a movable MEMS element having a portion that is free from the substrate and positioned adjacent the stationary element such that a variable-sized gap separating the movable MEMS element from the stationary element defines a dimension having a size that changes in response to movement of the movable MEMS element, wherein the dimension extends substantially parallel to the substrate; and

a cap attached to the substrate having upper and side walls that encapsulate the movable MEMS element and the stationary element.

64. The MEMS structure as recited in claim 63, further comprising at least one electrical trace having a first terminal end in electrical communication with the stationary element and a second terminal end in electrical communication with the peripheral region.

65. The MEMS structure as recited in claim 63, further comprising

a second stationary element extending from the substrate and disposed adjacent the movable MEMS element; and

a second electrical trace having a first terminal end in electrical communication with the second stationary element and a second terminal end in electrical communication with the peripheral region.

66. The MEMS structure as recited in claim 65, wherein the stationary elements are electrically isolated from each other.

67. The MEMS structure as recited in claim 63, wherein the stationary element is conductive.

68. The MEMS structure as recited in claim 63, wherein the movable MEMS element further comprises at least two conductive elements.

69. The MEMS structure as recited in claim 68, wherein the at least two conductive elements are electrically isolated from each other.

70. A MEMS structure surrounded by a peripheral region, the MEMS structure comprising:

a substrate;

at least one stationary element that is in mechanical communication with the substrate;

a movable MEMS element having a portion that is free from the substrate and positioned adjacent the stationary element such that a variable-sized gap extends substantially parallel to the substrate and separates the movable MEMS element from the stationary element; and

at least one electrical trace having a first terminal end in electrical communication with the at least one stationary element and a second terminal end in electrical communication with the peripheral region, wherein the trace is disposed within an electrically insulating layer between the stationary element and the substrate.

71. The MEMS structure as recited in claim 70, wherein the movable MEMS element defines outer ends that are permanently attached to the substrate, and wherein the portion that is free from the substrate is connected between the outer ends.

72. The MEMS structure as recited in claim 70, further comprising a cap attached to the substrate inside the peripheral region having upper walls and side walls that encapsulate the at least one stationary element and the movable MEMS element.

73. The MEMS structure as recited in claim 72, wherein the second terminal end extends outside the cap.

74. A MEMS structure surrounded by a peripheral region, the MEMS structure comprising:

a substrate;

first and second stationary elements in mechanical communication with the substrate;

a movable MEMS element having a portion that is free from the substrate and positioned adjacent the stationary elements such that first and second gaps separating the movable MEMS element from the first and second stationary elements, respectively, define variable-sized dimensions that extend substantially parallel to the substrate; and

first and second electrical traces having first terminal ends in electrical communication with the first and second stationary elements, respectively, and having second terminal ends in electrical communication with the peripheral region.

75. The MEMS structure as recited in claim 74, wherein the movable MEMS element defines outer ends that are permanently attached to the substrate, and wherein the portion that is free from the substrate is connected between the outer ends.

76. The MEMS structure as recited in claim 74, further comprising a cap attached to the substrate inside the peripheral region having upper walls and side walls that encapsulate the stationary elements and the movable MEMS element.

77. The MEMS structure as recited in claim 76, wherein the second terminal ends extend outside the cap.

78. The MEMS structure as recited in claim 77, wherein the second terminal ends are electrically isolated from each other.

79. The MEMS structure as recited in claim 74, wherein the movable MEMS element further comprises at least two conductive elements.

80. The MEMS structure as recited in claim 79, wherein the at least two conductive elements are electrically isolated from each other.