Dental curing light using primary and secondary heat sink combination

• US 6,783,362 B2
• Filed: 12/13/2001
• Issued: 08/31/2004
• Est. Priority Date: 09/24/1999
• Status: Expired due to Term

• Current Assignee: CAO Group, Inc.
• Original Assignee: CAO Group, Inc.
• Inventors: Cao, Densen
• Primary Examiner(s): Lewis, Ralph A.
• Application Number:
  US10/017,272
• Publication Number:
  US 20020197582A1
• Time in Patent Office: 992 Days
• Field of Search: 433/29, 433/215, 606/1, 606/13, 606/16, 607/88, 362/119, 362/800, 362/804
• US Class Current: 433/29
• CPC Class Codes: A61C 19/004 Hand-held apparatus, e.g. guns
• CPC Class Codes: A61N 2005/0652 Arrays of diodes
• CPC Class Codes: B23K 26/0096 Portable laser equipment, e.g. hand-held laser apparatus surgical laser instruments A61B18/20, Dental Lasers A61C1/0046, Hand-held laser dental apparatus for curing resins A61C19/004
• CPC Class Codes: B23K 26/064 by means of optical elements, e.g. lenses, mirrors or prisms
• CPC Class Codes: B23K 26/0643 comprising mirrors
• CPC Class Codes: B23K 26/0648 comprising lenses
• CPC Class Codes: B23K 26/0665 by beam condensation on the workpiece, e.g. for focusing
• CPC Class Codes: B23K 26/703 Cooling arrangements by using a fluid stream B23K26/14
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

A curing light system useful for curing light activated composite materials is disclosed. The system includes a light emitting semiconductor device, a primary heat sink and a secondary heat sink. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.

Claims

1. A dental curing light comprising:

a light module,

an elongate heat sink located in said light module, said elongate heat sink having a proximal end, a distal end and a longitudinal axis therebetween, said elongate heat sink being part of said light module,

a mounting platform located at said elongate heat sink distal end,

a primary heat sink mounted to said mounting platform, said primary heat sink being smaller in overall volume than said elongate heat sink,

a well located on said primary heat sink, and

a light emitting semiconductor device mounted in said well of said primary heat sink; and

wherein said mounting platform is oriented so that light emitted from said light emitting semiconductor device is emitted at generally a 30 to 150 degree angle to said elongate heat sink longitudinal axis.

2. A dental curing light as recited in claim 1 wherein said light emitting semiconductor device is mounted in said well by use of an adhesive selected from the group consisting of light reflective adhesive and heat conductive adhesive.

3. A dental curing light as recited in claim 1 wherein said light emitting semiconductor device is selected from the group consisting of light emitting diode chips, laser chips, light emitting diode chip array, diode laser chips, diode laser chip array, surface emitting laser chips, edge emitting laser chips, and VCSEL chips.

4. A dental curing light as recited in claim 1 wherein said light emitting semiconductor device utilizes a driving current of not more than about 350 millliamps.

5. A dental curing light as recited in claim 1 wherein said mounting platform is oriented so that light emitted from said light emitting semiconductor device is emitted generally orthogonal to said elongate heat sink longitudinal axis.

6. A dental curing light as recited in claim 1 wherein said mounting platform is oriented so that light emitted from said light emitting semiconductor device is emitted at generally a 45 to 135 degree angle to said elongate heat sink longitudinal axis.

7. A dental curing light as recited in claim 1 wherein at least one of said primary heat sink and said elongate heat sink include material selected from the group consisting of copper, aluminum, silicon carbide, boron nitride, natural diamond, monocrystalline diamond, polycrystalline diamond, polycrystalline diamond compact, diamond deposited through chemical vapor deposition, and diamond deposited through physical vapor deposition.

8. A dental curing light as recited in claim 1 wherein said light emitting semiconductor device includes a substrate and epitaxial layers grown thereon.

9. A dental curing light as recited in claim 8 wherein said substrate is selected from the group consisting of Si, GaAs, GaN, InP, sapphire, SiC, GaSb and InAs.

10. A dental curing light as recited in claim 8 wherein said epitaxial layers include at least one active layer, at least one cladding layer, at least one buffer layer, and at least one contact layer.

11. A dental curing light as recited in claim 8 wherein at least one of said epitaxial layers includes a GaN.

12. A dental curing light as recited in claim 1 further comprising a cover over said light emitting semiconductor device.

13. A dental curing light as recited in claim 12 wherein said cover is transparent.

14. A dental curing light as recited in claim 12 wherein said cover is a focus lens.

15. A dental curing light as recited in claim 1 wherein said well includes a light reflective coating on its interior.

16. A dental curing light as recited in claim 1 further comprising electronic circuitry for controlling operation of the dental curing light.

17. A dental curing light as recited in claim 16 wherein said electronic circuitry is capable of providing pulsed current input to said light emitting semiconductor device.

18. A dental curing light as recited in claim 1 further comprising a thermoelectric cooler on said elongate heat sink, said thermoelectric cooler assisting in heat dissipation.

19. A dental curing light comprising:

a light module,

an elongate heat sink located in said light module, said elongate heat sink having a proximal end, a distal end and a longitudinal axis therebetween, said elongate heat sink being part of said light module,

a mounting location located at said elongate heat sink distal end,

a primary heat sink mounted to said mounting location, said primary heat sink being smaller in overall volume than said elongate heat sink,

a light emitting semiconductor device mounted to said primary heat sink at said mounting location; and

wherein said mounting location is oriented so that light emitted from said light emitting semiconductor device is emitted at generally a 30 to 150 degree angle to said elongate heat sink longitudinal axis.

20. A dental curing light comprising:

an elongate heat sink, said elongate heat sink having a proximal end, a distal end and a longitudinal axis therebetween,

a light emitting semiconductor device mounted in a fixed position with respect to said primary elongate heat sink;

wherein said light emitting semiconductor device emits at least some light that travels in a direction that is in the range of a 30 to 150 degree angle to said elongate heat sink longitudinal axis.