Optical interconnect structure, system and transceiver including the structure, and method of forming the same

• US 6,786,651 B2
• Filed: 03/22/2002
• Issued: 09/07/2004
• Est. Priority Date: 03/22/2001
• Status: Active Grant

• Current Assignee: Goldcup 5514 Ab Unat Tyco Electronics Svenska Holdings AB, Tyco Electronics Services GmbH (TE Connectivity Ltd. (United Kingdom))
• Original Assignee: Primarion Incorporated (Infineon Technologies AG)
• Inventors: Burns, John, Golwalkar, Suresh, Chou, Wuchun, Davis, Noah, Carroll, Robert, Raj, Kannan, McClay, C. Phillip
• Primary Examiner(s): WILLE, DOUGLAS A
• Application Number:
  US10/104,942
• Publication Number:
  US 20020175339A1
• Time in Patent Office: 900 Days
• Field of Search: 385/49, 385/88
• US Class Current: 385/88
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/424 Mounting of the optical light guide
• CPC Class Codes: G02B 6/4245 Mounting of the opto-electronic elements
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures
• CPC Class Codes: G02B 6/4257 having a supporting carrier or a mounting substrate or a mounting plate G02B6/3648 takes precedence
• CPC Class Codes: G02B 6/4269 with heat sinks or radiation fins
• CPC Class Codes: G02B 6/4274 Electrical aspects G02B6/4263 and G02B6/4265 take precedence
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections

Abstract

A system for coupling optoelectronic devices, associated electrical components, and optical fibers is described. The system includes a substrate to which optoelectronic devices and at least some of the associated electronic components are formed on or formed using the substrate material. The substrate is further configured to receive and attach to one or more optical fibers. The system can be used to form transceivers for multiplexing and/or demultiplexing electronic information.

Claims

1. An optical interconnect system comprising:

an optoelectronic device formed on a silicon substrate;

a groove formed in a top surface of said silicon substrate;

an optical fiber adhesively attached in said groove; and

a faceted reflective surface including a blazed grating formed into the top surface of the silicon substrate at an angle of approximately 54 degrees from the top surface of the substrate in optical alignment with the optical fiber.

2. An optical interconnect system as in claim 1, wherein the blazed grating has a pitch of approximately one micron.

3. A multi-channel optical interconnect system comprising:

a plurality of optoelectronic devices formed on a first silicon substrate;

a plurality of grooves formed proximate to each other and in parallel alignment in a top surface of said first silicon substrate;

a plurality of optical fibers adhesively attached in said plurality of grooves in optical alignment with said plurality of optoelectronic devices; and

a rod lens positioned transverse to said plurality of grooves and interposed in the optical path between said plurality of optoelectronic devices and said plurality of optical fibers.

4. A multi-channel optical interconnect system as in claim 3 further comprising:

a second silicon substrate attached to the top surface of said first silicon substrate;

a microelectronic device attached to said second silicon substrate; and

an electrical connection between said microelectronic device and at least one of said plurality of optoelectronic devices.

5. A multi-channel optical interconnect system as in claim 4 wherein said optoelectronic devices are VCSEL'"'"'s and said microelectronic device includes VCSEL drivers.

6. A multi-channel optical interconnect system as in claim 4 further comprising:

a third silicon substrate attached to the top surface of said first silicon substrate;

a microelectronic device attached to said third silicon substrate; and

an electrical connection between said microelectronic device and at least one of said plurality of optoelectronic devices.

7. A multi-channel optical interconnect system as in claim 6 wherein said optoelectronic devices are optical sensors and said microelectronic device is a sensor amplifier.