Complex high frequency components

• US 6,788,164 B2
• Filed: 08/02/2002
• Issued: 09/07/2004
• Est. Priority Date: 08/03/2001
• Status: Expired due to Term

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Maekawa, Tomoya, Yamada, Toru, Nakakubo, Hideaki, Shigemura, Hiroshi, Kawahara, Emiko
• Primary Examiner(s): Tokar, Michael
• Assistant Examiner(s): NGUYEN, KHAI M
• Application Number:
  US10/209,893
• Publication Number:
  US 20030025571A1
• Time in Patent Office: 767 Days
• Field of Search: 333/25, 333/26, 333/202, 333/204, 333/219, 174/255
• US Class Current: 333/26
• CPC Class Codes: H01P 1/20345 Multilayer filters

Abstract

The present invention comprises baluns 2a, 2b which convert balanced line signals and unbalanced line signals mutually, and filters 3a, 3b which are electrically connected to the baluns 2a, 2b and pass or attenuate the predetermined frequency bands. Electrode layers 15a-22a, 25a, 41, 42, 43 which compose the electrode patterns of the baluns 2a, 2b and the filters 3a, 3b, and the dielectric layers 30-39 are integrally stacked.

Claims

1. A complex high frequency component comprising:

a balun for mutually converting a balanced line signal and an unbalanced line signal; and

a filter for passing or attenuating predetermined frequency bands, said filter being electrically connected to said balun,

said complex high frequency component further comprising;

an electrode layer including a first electrode layer which comprises electrode patterns for said balun and a second electrode layer which comprises electrode patterns for said filter;

a dielectric layer, wherein said dielectric layer and said first and second electrode layers are integrally stacked, and wherein said first electrode layer comprising the electrode pattern of said balun and said second electrode layer comprising the electrode pattern of said filter are arranged in different positions from each other on said dielectric layer, and

a first shield electrode layer disposed between said first electrode layer comprising the electrode pattern of said balun and said second electrode layer comprising the electrode pattern of said filter.

2. The complex high frequency component according to claim 1, comprising a plurality of said electrode layers which are stacked with said dielectric layer disposed therebetween.

3. The complex high frequency component according to claim 2, wherein a dielectric constant of said dielectric layer in a filter forming area and a dielectric constant of said dielectric layer in a balun forming area are set at different values from each other.

4. The complex high frequency component according to claim 1, wherein said first electrode layer comprising the electrode pattern of said balun and the second electrode layer comprising the electrode pattern of said filter are stacked with said dielectric layer disposed therebetween.

5. The complex high frequency component according to claim 1, wherein said dielectric layer functions as a circuit structure component for said balun and said filter.

6. The complex high frequency component according to claim 1, further comprising an edge electrode, which is connected to said first shield electrode layer, on a side of the complex high frequency component.

7. The complex high frequency component according to claim 6, wherein said edge electrode has a smaller width than said side.

8. The complex high frequency component of claim 1, wherein said balun is disposed on a mounting side of the complex high frequency component and said filter is disposed on the non-mounting side opposing said mounting side.

9. The complex high frequency component according to claim 1, wherein said filter is disposed on a mounting side of the complex high frequency component and said balun is disposed on the non-mounting side opposing said mounting side.

10. The complex high frequency component according to claim 1, further comprising an edge electrode on a side of the complex high frequency component, wherein said filter and said balun are connected to each other via said edge electrode.

11. The complex high frequency component according to claim 1, further comprising, on a side of the complex high frequency component, an edge electrode connected to said balun and another edge electrode connected to said filter.

12. The complex high frequency component of claim 11, further comprising a shield electrode on said side of said complex high frequency component, said shield electrode being disposed between said edge electrodes.

13. The complex high frequency component according to claim 1, further comprising two edge electrodes disposed on the sides composing a pair of opposing sides respectively, one edge electrode being connected to input/output ends of said balun, and the other edge electrode being connected to input/output ends of said filter.

14. The complex high frequency component according to claim 1, comprising first to tenth dielectric layers stacked in that order, wherein said electrode layer comprises:

a second shield electrode layer disposed between said first dielectric layer and said second dielectric layer;

a second transmission line electrode layer disposed between said second dielectric layer and said third dielectric layer;

a coupling capacitor electrode layer disposed between said second dielectric layer and said third dielectric layer;

a first transmission line electrode layer disposed between said third dielectric layer and said fourth dielectric layer;

a third transmission line electrode layer disposed between said fourth dielectric layer and said fifth dielectric layer;

said first shield electrode layer disposed between said fifth dielectric layer and said sixth dielectric layer;

an input/output coupling capacitor electrode layer disposed between said sixth dielectric layer and said seventh dielectric layer;

a plurality of resonator electrode layers disposed between said seventh dielectric layer and said eighth dielectric layer;

a coupling capacitor electrode layer disposed between said eighth dielectric layer and said ninth dielectric layer; and

a third shield electrode layer disposed between said ninth dielectric layer and said tenth dielectric layer, and

wherein an edge electrode which connects said input/output coupling capacitor electrode layer and said first transmission line electrode layer is disposed on a side of said first to tenth dielectric layers.

15. The complex high frequency component according to claim 14, wherein said resonator electrode layers are electromagnetically coupled each other.

16. The complex high frequency component according to claim 14, wherein said first transmission line electrode layer and said second transmission line electrode layer are electromagnetically coupled each other, and said first transmission line electrode layer and said third transmission line electrode layer are electromagnetically coupled each other.

17. The complex high frequency component according to claim 1, comprising first to ninth dielectric layers stacked in that order, wherein said electrode layer comprises:

a second shield electrode layer disposed between said first dielectric layer and said second dielectric layer;

a second transmission line electrode layer disposed between said second dielectric layer and said third dielectric layer;

a third transmission line electrode layer disposed between said second dielectric layer and said third dielectric layer;

a first transmission line electrode layer disposed between said third dielectric layer and said fourth dielectric layer;

said first shield electrode layer disposed between said fourth dielectric layer and said fifth dielectric layer;

an input/output coupling capacitor electrode layer disposed between said fifth dielectric layer and said sixth dielectric layer;

a plurality of resonator electrode layers disposed between said sixth dielectric layer and said seventh dielectric layer;

a coupling capacitor electrode layer disposed between said seventh dielectric layer and said eighth dielectric layer; and

a third shield electrode layer disposed between said eighth dielectric layer and said ninth dielectric layer, and

wherein an edge electrode which connects said input/output coupling capacitor electrode layer and said first transmission line electrode layer is disposed on a side of said first to tenth dielectric layers.

18. The complex high frequency component according to claim 17, wherein said resonator electrode layers are electromagnetically coupled each other.

19. The complex high frequency component according to claim 17, wherein said first transmission line electrode layer and said second transmission line electrode layer are electromagnetically coupled each other, and said first transmission line electrode layer and said third transmission line electrode layer are electromagnetically coupled each other.

20. The complex high frequency component according to claim 1, comprising first to ninth dielectric layers stacked in that order, wherein said electrode layer comprises:

a second shield electrode layer disposed between said first dielectric layer and said second dielectric layer;

a first transmission line electrode layer disposed between said second dielectric layer and said third dielectric layer;

a second transmission line electrode layer disposed between said third dielectric layer and said fourth dielectric layer;

a third transmission line electrode layer disposed between said third dielectric layer and said fourth dielectric layer;

said first shield electrode layer disposed between said fourth dielectric layer and said fifth dielectric layer;

an input/output coupling capacitor electrode layer disposed between said fifth dielectric layer and said sixth dielectric layer;

a plurality of resonator electrode layers disposed between said sixth dielectric layer and said seventh dielectric layer;

a coupling capacitor electrode layer disposed between said seventh dielectric layer and said eighth dielectric layer; and

a third shield electrode layer disposed between said eighth dielectric layer and said ninth dielectric layer, and

wherein an edge electrode which connects said input/output coupling capacitor electrode layer and said first transmission line electrode layer is disposed on a side of said first to tenth dielectric layers.

21. The complex high frequency component according to claim 20, wherein said resonator electrode layers are electromagnetically coupled each other.

22. The complex high frequency component according to claim 20, wherein said first transmission line electrode layer and said second transmission line electrode layer are electromagnetically coupled each other, and said first transmission line electrode layer and said third transmission line electrode layer are electromagnetically coupled each other.

23. The complex high frequency component according to claim 1, comprising;

a capacitor disposed between said balun and the ground, and

an auxiliary connection terminal disposed between said capacitor and said balun.

24. The complex high frequency component according to claim 23, further comprising:

a power supply connected to said auxiliary connection terminal; and

an active element which is connected to said balun and is powered from said power supply.

25. The complex high frequency component according to claim 23, wherein

said balun has two pairs of transmission lines, one pair of said two pairs of transmission lines having first and second transmission lines electromagnetically coupled with each other, said first transmission line having a first connection terminal at one end, and said second transmission line having a second connection terminal at one end,

the other pair of said two pairs of transmission lines having third and fourth transmission lines electromagnetically coupled with each other, said fourth transmission line has a third connection terminal at one end,

said second connection terminal and said third connection terminal compose a balanced terminal;

the other end of said first transmission line is coupled with an end of said third transmission line;

the other end of said second transmission line and the other end of said fourth transmission line are grounded via said capacitor; and

said auxiliary connection terminal is disposed between the other ends of said second transmission line and said fourth transmission line and said capacitor.

26. The complex high frequency component according to claim 25, wherein the other end of said second transmission line and the other end of said fourth transmission line are mutually connected.

27. The complex high frequency component according to claim 26, wherein said auxiliary connection terminal is connected to a connection end disposed between said second transmission line and said fourth transmission line.

28. The complex high frequency component according to claim 25, wherein each pair of said two pairs of transmission lines is disposed on a same plane.

29. The complex high frequency component according to claim 25, wherein each pair of said two pairs of transmission lines is composed of transmission lines which are arranged to face each other via said dielectric layer.

30. The complex high frequency component according to claim 23, wherein said auxiliary connection terminal is connected to said balun via an inductance.

31. The complex high frequency component according to claim 23, wherein said capacitor is composed of said dielectric layer and said electrode layer.

32. The complex high frequency component according to claim 23, wherein an inductance is disposed between said auxiliary connection terminal and said balun, and said inductance, said dielectric layer and said electrode layer are integrally stacked.

33. A communication device having the complex high frequency component according to claim 1.