Semiconductor device with strain relieving bump design

• US 6,790,759 B1
• Filed: 07/31/2003
• Issued: 09/14/2004
• Est. Priority Date: 07/31/2003
• Status: Expired due to Term

• Current Assignee: North Star Innovations Inc. (Wi-LAN Inc.)
• Original Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Inventors: Wang, James Jen-Ho, Jang, Jin-Wook, Mendoza, Alfredo, Runton, Rajashi, Shumway, Russell
• Primary Examiner(s): GURLEY, LYNNE ANN
• Application Number:
  US10/631,102
• Time in Patent Office: 411 Days
• Field of Search: 438/612-613, 438/622
• US Class Current: 438/612
• CPC Class Codes: H01L 2224/0231 Manufacturing methods of the redistribution layers
• CPC Class Codes: H01L 2224/02335 Free-standing redistribution layers
• CPC Class Codes: H01L 2224/0235 Shape of the redistribution layers
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05008 Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body, e.g.
• CPC Class Codes: H01L 2224/05548 Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05569 the external layer being disposed on a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/081 Disposition
• CPC Class Codes: H01L 2224/1147 using a lift-off mask
• CPC Class Codes: H01L 2224/13027 the bump connector being offset with respect to the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 23/3114 the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 24/03 Manufacturing methods
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/08 of an individual bonding area
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits

Abstract

A semiconductor device (51) is provided. The device (51) comprises a die (53) having a contact pad (61) thereon, a redistribution conductor (59) having a base portion (64) which is in electrical communication with the contact pad (61) and a laterally extending portion (63), a bumped contact (65) which is in electrical communication with the redistribution conductor (59), and a passivation layer (57) disposed between the laterally extending portion (63) of the redistribution conductor (59) and the die (53). Preferably, the redistribution conductor (59) is convoluted and is adapted to peel or delaminate from the passivation layer (57) under sufficient stress so that it can shift relative to the passivation layer (57) and base portion (64) to relieve mechanical stress between substrate (69) and the die (53). Bump and coiled redistribution conductor (59) accommodating small CTE mis-match strain without failure allows DCA flip-chip to be reliable without underfill or additional assembly process.

Claims

1. A method for making a semiconductor device, comprising the steps of:

providing a semiconductor substrate having a contact pad;

forming a passivation layer over the substrate and patterning the passivation layer such that at least a portion of the contact pad is exposed; and

forming a redistribution conductor having a base portion which is in electrical communication with the contact pad and having a convoluted, laterally extending portion which extends over the passivation layer;

wherein the laterally extending portion forms a frangible bond to the passivation layer.

2. The method of claim 1, further comprising the step of forming a release layer over the passivation layer.

3. The method of claim 2, wherein the release layer is disposed between the redistribution conductor and the passivation layer.

4. The method of claim 2, wherein the release layer comprises TiW.

5. The method of claim 1, wherein the redistribution conductor is formed by:

depositing a metallization layer over the passivation layer;

depositing and patterning a photoresist layer over the metallization layer such that a portion of the metallization layer is exposed; and

electroplating the material of the redistribution conductor onto the exposed portion of the metallization layer.

6. The method of claim 5, wherein the material of the redistribution conductor is electroplated to a minimum thickness of at least about 3 microns as measured along an axis extending through the center of, and orthogonal to, the laterally extending portion.

7. A method for making a semiconductor device, comprising the steps of:

providing a semiconductor substrate having a contact pad;

depositing a passivation laser over the substrate and patterning the passivation layer such that at least a portion of the contact pad is exposed;

depositing a metallization layer over the passivation layer;

depositing a photoresist layer over the metallization layer and patterning the photoresist layer such that at least a portion of the metallization layer in the vicinity of the contact pad is exposed; and

electroplating a redistribution conductor onto the exposed portion of the metallization layer such that the redistribution conductor has a base portion which is in electrical communication with the contact pad, and a laterally extending portion.

8. The method of claim 7, wherein the redistribution conductor has an average minimum thickness of at least about 3 microns as measured along an axis extending through the center of, and orthogonal to, the laterally extending portion.

9. The method of claim 7, wherein the photoresist layer is patterned such that the laterally extending portion is convoluted.

10. The method of claim 7, wherein the metallization layer forms a frangible bond to the passivation layer.

11. The method of claim 7, wherein the photoresist layer is patterned such that the laterally extending portion is essentially serpentine in shape.

12. The method of claim 7, wherein the laterally extending portion has an average minimum thickness within the range of about 8 to about 16 microns as measured along an axis extending through the center of, and orthogonal to, the laterally extending portion.

13. The method of claim 7, further comprising the step of forming a solder bump in electrical communication with the redistribution conductor near an end of the redistribution conductor opposite the base portion.

14. The method of claim 7, wherein the laterally extending portion is connected to a solder joint and is adapted to reduce stress applied to the solder joint by delaminating from the passivation layer.

15. The method of claim 7, wherein the laterally extending portion is connected to a solder joint, and wherein the bond between the passivation layer and the metallization layer is sufficiently frangible such that the laterally extending portion separates from the passivation layer when sufficient stress is applied to the solder joint.

16. The method of claim 7, wherein the redistribution conductor comprises copper, wherein the metallization layer comprises a first layer of TiW and a second layer of copper, and wherein the passivation layer comprises a polymide.

17. The method of claim 7, further comprising the step of depositing a dewetting agent over portions of the redistribution conductor.

18. The method of claim 17, wherein both the metallization layer and the dewetting agent comprise TiW.