Solder interconnections for flat circuits
First Claim
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1. A system for facilitating the interconnection of the conductors of a pair flat circuits, comprising:
- a first flat circuit having a plurality of conductors covered by a dielectric film, with an opening in the film to selectively expose the conductors, and a layer of solder material on the exposed conductors in the opening; and
a second flat circuit having a plurality of conductors covered by a dielectric film, with an opening in the film to selectively expose the conductors, and a layer of solder material on the exposed conductors in the opening;
whereby said openings can be juxtaposed with the flat circuits overlapping each other to facilitate interconnecting the conductors of the two flat circuits by an appropriate soldering process using the preapplied solder material.
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Abstract
A system and method are provided for facilitating the interconnection of the conductors of a flat circuit. A flat circuit substrate is provided with a plurality of conductors thereon. A dielectric film on the substrate substantially covers the conductors. An opening is formed in the film to selectively expose the conductors. A layer of solder material is preapplied to the exposed conductors in the opening. Therefore, the opening can be juxtaposed with a mating conductor to facilitate interconnecting the conductors by an appropriate soldering process using the preapplied solder material.
7 Citations
32 Claims
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1. A system for facilitating the interconnection of the conductors of a pair flat circuits, comprising:
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a first flat circuit having a plurality of conductors covered by a dielectric film, with an opening in the film to selectively expose the conductors, and a layer of solder material on the exposed conductors in the opening; and
a second flat circuit having a plurality of conductors covered by a dielectric film, with an opening in the film to selectively expose the conductors, and a layer of solder material on the exposed conductors in the opening;
whereby said openings can be juxtaposed with the flat circuits overlapping each other to facilitate interconnecting the conductors of the two flat circuits by an appropriate soldering process using the preapplied solder material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A system for facilitating the interconnection of the conductors of a flat circuit, comprising:
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a flat circuit substrate;
a plurality of conductors on the substrate;
a dielectric film on the substrate substantially covering the conductors, with an opening in the film to selectively expose at least one of the conductors; and
a layer of solder material on the exposed conductor in the opening, whereby said opening can be juxtaposed with a mating conductor to facilitate interconnecting the conductors by an appropriate soldering process using the preapplied solder material. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A method of fabricating and interconnecting the conductors of a pair of flat circuits, comprising the steps of:
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providing a first flat circuit having a plurality of conductors covered by a dielectric film;
forming an opening in the film to selectively expose at least some of the conductors;
applying a layer of solder material on the exposed conductors in the opening;
providing a second flat circuit having a plurality of conductors covered by a dielectric film;
forming an opening in the film of the second flat circuit to selectively expose at least some of the conductors thereof;
applying a layer of solder material on the exposed conductors of the second flat circuit in the opening thereof;
overlapping the flat circuits with the openings in the respective dielectric films thereof in juxtaposition; and
soldering the conductors of the second flat circuit through the juxtaposed openings using the preapplied solder material. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24)
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25. A method of fabricating a flat circuit, comprising the steps of:
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providing a flat circuit substrate with a plurality of conductors thereon and covered by a dielectric film;
forming an opening in the film to selectively expose at least some of the conductors;
applying a layer of solder material on the exposed conductors in the opening;
whereby said opening can be juxtaposed with a mating conductor to facilitate interconnecting the conductors by an appropriate soldering process using the preapplied solder material. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32)
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Specification