Method of attaching a die to a substrate

  • US 6,798,074 B2
  • Filed: 03/04/2002
  • Issued: 09/28/2004
  • Est. Priority Date: 03/04/2002
  • Status: Expired due to Term
First Claim
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1. A semiconductor device, comprising:

  • a base carrier having a top side and a bottom side, the top side having a central area for receiving an integrated circuit die and a peripheral area;

    an extended adhesive material layer disposed on the top side of the base carrier, the adhesive material layer covering the central area and a large portion of the peripheral area of the base carrier top surface, wherein the adhesive material extends beyond edges of the die a distance greater than about two times a thickness of the die; and

    an integrated circuit die attached to the base carrier with the adhesive material layer at the central area.

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