Method for transporting boards, load port apparatus, and board transport system

• US 6,808,352 B2
• Filed: 08/16/2002
• Issued: 10/26/2004
• Est. Priority Date: 08/20/2001
• Status: Expired due to Fees

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Semiconductor Leading Edge Technologies, Inc.
• Inventors: Seita, Hisaharu
• Primary Examiner(s): DILLON JR, JOSEPH A
• Application Number:
  US10/219,820
• Publication Number:
  US 20030049101A1
• Time in Patent Office: 802 Days
• Field of Search: 414/217, 414/217.1, 414/935, 414/940
• US Class Current: 414/217.1
• CPC Class Codes: H01L 21/67379 characterised by coupling elements, kinematic members, handles or elements to be externally gripped
• CPC Class Codes: H01L 21/67393 characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
• CPC Class Codes: H01L 21/67772 involving removal of lid, door, cover
• CPC Class Codes: H01L 21/67775 Docking arrangements
• CPC Class Codes: Y10S 414/139 including wafer charging or discharging means for vacuum chamber
• CPC Class Codes: Y10S 414/14 Wafer cassette transporting

Abstract

A substrate container having substrates stored therein and sealed with a door is placed onto a load port apparatus provided on a substrate processing system, and a door of the load port apparatus is docked with the door of the substrate container. An inside of the substrate container is pressurized before opening of the door of the substrate container before the door of the substrate container is opened and the substrates stored in the substrate container is transported to the substrate processing system.

Claims

1. A method of transporting substrates comprising the steps of:

placing a substrate container having substrates stored therein and sealed with a door on a load port apparatus provided on a substrate processing system;

docking a door of the load port apparatus with the door of the substrate container;

pressurizing an inside of the substrate container so that the pressure inside the substrate container is higher than the internal pressure of an enclosure provided in the substrate processing system by a given level;

opening the door of the substrate container while the pressure inside the substrate container is such that inflow of outside air or gas from the enclosure is prevented; and

transporting the substrates stored in the substrate container to the substrate processing system.

2. The method of transporting substrates according to claim 1, wherein pressurized gas is introduced from the outside of the substrate container by way of a gas flow channel which is provided in the substrate container and has a filter in the step of pressurizing.

3. The method of transporting substrates according to claim 2, wherein the pressurized gas is introduced while the volume of pressurized gas to be introduced is changed gently.

4. The method of transporting substrates according to claim 1, wherein pressurization is effected in association with opening of the door of the substrate container.

5. The method of transporting substrates according to claim 1, wherein pressurization is effected immediately after the load port door and the door of the substrate container have docked with each other until the door of the substrate container finishes opening.

6. The method of transporting substrates according to claim 1, wherein pressurization is effected immediately after the substrate container has been placed on a table section of the load port until the door of the substrate container finishes opening.