Microelectronic spring with additional protruding member

• US 6,811,406 B2
• Filed: 04/12/2001
• Issued: 11/02/2004
• Est. Priority Date: 04/12/2001
• Status: Expired due to Fees

• Current Assignee: FormFactor Incorporated, Olympus Optical Corporation Limited (Olympus Corporation)
• Original Assignee: FormFactor Incorporated
• Inventors: Grube, Gary W.
• Primary Examiner(s): Abrams, Neil
• Application Number:
  US09/834,074
• Publication Number:
  US 20020151194A1
• Time in Patent Office: 1,300 Days
• Field of Search: 439/862, 439/81, 439/66, 439/197, 439/259, 439/266, 324/754, 324/762, 174/260, 174/261, 361/774
• US Class Current: 439/66
• CPC Class Codes: G01R 1/06727 Cantilever beams
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01R 12/57 surface mounting terminals
• CPC Class Codes: H01R 13/2464 characterized by the contact point

Abstract

Various structural features for modifying the performance characteristic of cantilevered microelectronic spring structures are disclosed. Generally, the features comprise a protruding member mounted between a supporting substrate and the transverse cantilever beam of a microelectronic spring structure, at a distance spaced apart from the supporting structure from which the beam is cantilevered. The protruding member may be equal to the clearance under the beam, less than the clearance under the beam, or adjustable in height; and may be attached or mounted to either the beam or the substrate. The protruding member may include an adjustable pressure device or an electronic element. The protruding member may induce a reverse wipe.

Claims

1. A microelectronic spring structure, comprising:

a substrate;

a beam;

an elongate post component between said substrate and said beam, whereby said beam is spaced apart from and secured to said substrate, said post component comprise of a wire core coated with a structural material; and

a protruding member mounted to said substrate, and disposed under said beam;

wherein said microelectronic spring structure is reversibly deflectable between an undeflected position wherein the protruding member does not contact said beam, and a deflected position wherein said protruding member contacts said beam.

2. The microelectronic spring structure of claim 1, further comprising a tip structure for contacting a terminal of an electronic component, said tip structure mounted to and disposed above a surface of said beam opposite to said substrate.

3. The microelectronic spring structure of claim 2, wherein said tip structure is mounted to an end of said beam.

4. The microelectronic spring structure of claim 2, wherein said tip structure is positioned above all of said beam, relative to said substrate.

5. The microelectronic spring structure of claim 2, wherein said tip structure comprises a stand-off mounted to said beam, and a contact tip mounted to said stand-off.

6. The microelectronic spring structure of claim 1, wherein said beam is connected to a first terminal of an electronic component on said substrate, and said protruding member is connected to a second terminal of the electronic component on said substrate.

7. The microelectronic spring structure of claim 1, wherein said beam is connected to a terminal of an electronic component on said substrate, and said protruding member is not connected to any electronic component.

8. The microelectronic spring structure of claim 1, wherein said beam and said protruding member are connected to a shared terminal of an electronic component on said substrate.

9. The microelectronic spring structure of claim 1, wherein said beam is electrically isolated from said protruding member when said microelectronic spring structure is in the undeflected position.

10. The microelectronic spring structure of claim 1, wherein said beam is formed by a lithographic process on a sacrificial substrate.

11. The microelectronic spring structure of claim 1, wherein said beam is formed by lithographic process on a sacrificial layer.

12. The microelectronic spring structure of claim 1, wherein said post component comprises a column element.

13. The microelectronic spring structure of claim 1, wherein said post component comprises a group of column elements.

14. The microelectronic spring structure of claim 1, wherein said beam is straight and elongate.

15. The microelectronic spring structure of claim 1, wherein said beam is contoured.

16. The microelectronic spring structure of claim 1, wherein said protruding member comprises a wire bonded to said substrate.

17. The microelectronic spring structure of claim 16, wherein said protruding member further comprises a structural material coated over said wire.

18. The microelectronic spring structure of claim 1, wherein said post component is disposed under a middle portion of said beam.

19. The microelectronic spring structure of claim 18, further comprising an electronic device connected to said beam and to said substrate.

20. The microelectronic spring structure of claim 19, wherein said electronic device comprises a capacitor.

21. The microelectronic spring structure of claim 1, wherein said protruding member comprises a substantially compressible member.

22. The microelectronic spring structure of claim 21, wherein said protruding member comprises an elastic membrane enclosing a fluid.

23. The microelectronic spring structure of claim 1, wherein said protruding member comprises an adjustable pressure device.

24. The microelectronic spring structure of claim 23, wherein said protruding member comprises a rotating cam.

25. A microelectronic spring structure, comprising:

a substrate;

a beam, having a base portion, a cantilevered portion extending from said base portion,

and a tip portion adjoining said cantilevered portion at an end thereof opposite to said

base portion, said beam secured to said substrate at said base portion; and

a protruding member mounted to said substrate, and disposed under said cantilevered portion of said beam, said protruding member comprising a wire core bonded to said substrate and encased in a structural material;

wherein said microelectronic spring structure is reversibly deflectable between an undeflected position wherein the protruding member does not contact said beam, and a deflected position wherein said protruding member contacts said beam.

26. The microelectronic spring structure of claim 25, wherein said beam is electrically isolated from said protruding member when said microelectronic spring structure is in the undeflected position.

27. The microelectronic spring structure of claim 25, wherein said beam is formed by a lithographic process.

28. The microelectronic spring structure of claim 25, further comprising a tip structure for contacting a terminal of an electronic component, said tip structure mounted to said tip portion of said beam and positioned above all of said beam relative to said substrate.

29. The microelectronic spring structure of claim 25, wherein said protruding member is spaced apart from said tip portion, whereby said protruding member contacts said cantilevered portion of said beam at a position spaced apart from said tip portion when said microelectronic spring structure is in the deflected position.

30. The microelectronic spring structure of claim 25, wherein said beam is straight and elongate.

31. The microelectronic spring structure of claim 25, wherein said beam is contoured.

32. The microelectronic spring structure of claim 25, wherein said protruding member comprises a column, said column having a first end attached to said substrate, and a second end disposed under said beam above said substrate.

33. The microelectronic spring structure of claim 25, further comprising a post component securing said base portion to said substrate, whereby said base portion is spaced apart from and secured to said substrate.

34. The microelectronic spring structure of claim 25, wherein said cantilevered portion of said beam extends away from said substrate.

35. A microelectronic spring structure, comprising:

a substrate;

a beam, having a base portion, a cantilevered portion extending from said base portion, and a separately extending portion extending from said base portion in a direction different from said cantilever portion;

a post component mounted to said substrate and to said base portion from said beam, whereby said base portion of said beam is spaced apart from and secured to said substrate; and

an electronic device connected to said separately extending portion of said beam and to said substrate;

wherein said microelectronic spring structure is reversibly deflectable between an undeflected position wherein said cantilevered portion of said beam is substantially free of strain, and a deflected position wherein said cantilevered portion is deflected towards said substrate under the influence of an externally applied force.

36. The microelectronic spring structure of claim 35, wherein said beam further comprises a tip portion adjoining said cantilevered portion at an end thereof opposite to said base portion.

37. The microelectronic spring structure of claim 36, further comprising a tip structure for contacting an electronic component, said tip structure mounted to said tip portion of said beam.

38. The microelectronic spring structure of claim 35, wherein said electronic device comprises a capacitor.

39. The microelectronic spring structure of claim 35, wherein said beam is formed by a lithographic process on a sacrificial substrate.

40. The microelectronic spring structure of claim 35, wherein said post component comprises a column element, said column element comprised of a wire core coated with a structural material.

41. The microelectronic spring structure of claim 40, wherein said post component comprises a group of column elements.

42. The microelectronic spring structure of claim 41, wherein each column element of said group is comprised of a wire core coated with a structural material.

43. The microelectronic spring structure of claim 35, wherein said beam is straight and elongate.

44. The microelectronic spring structure of claim 35, wherein said beam is contoured.

45. A microelectronic spring structure, comprising:

a substrate;

a beam, having a base portion, and a cantilevered portion extending from said base portion, said beam secured to said substrate at said base portion; and

an adjustable device disposed under said beam providing a stop for said beam that is adjustable between at least two different positions,

wherein said microelectronic spring structure is reversibly deflectable between an undeflected position in which said beam is spaced from said adjustable device and a deflected position in which said beam is deflected into contact with said adjustable device.

46. The microelectronic spring structure of claim 45, wherein said adjustable device comprises an elastic membrane enclosing a fluid.

47. The microelectronic spring structure of claim 45, wherein said beam is formed by a lithographic process on a sacrificial substrate.

48. A microelectronic spring structure, comprising:

a substrate;

a beam, having a base portion, and a cantilevered portion extending from said base portion, said beam secured to said substrate at said base portion;

an adjustable device disposed under said beam providing a stop for said beam that is adjustable between at least two different positions; and

a post component securing said substrate to said base portion of said beam,

whereby said base portion of said beam is spaced apart from and secured to said substrate, and

wherein said post component comprises a column element, said column element comprised of a wire core coated with a structural material.

49. A microelectronic spring structure, comprising:

a substrate;

a beam, having a base portion, and a cantilevered portion extending from said base

portion, said beam secured to said substrate at said base portion; and

a compressible protruding member disposed under said beam,

wherein said post component comprises a column element, said column element comprised of a wire core coated with a structural material.