Method of fabricating a microelectromechanical system (MEMS) device using a pre-patterned substrate

• US 6,815,243 B2
• Filed: 04/26/2001
• Issued: 11/09/2004
• Est. Priority Date: 04/26/2001
• Status: Expired due to Fees

• Current Assignee: Rockwell Technologies, LLC
• Original Assignee: Rockwell Automation Technologies Incorporated (Allen-Bradley Co., Inc.)
• Inventors: Kretschmann, Robert J., Harris, Richard D., Lucak, Mark A., Knieser, Michael J.
• Primary Examiner(s): COLEMAN, WILLIAM D
• Application Number:
  US09/843,563
• Publication Number:
  US 20020158040A1
• Time in Patent Office: 1,293 Days
• Field of Search: 438/52, 438/48, 216/2
• US Class Current: 438/52
• CPC Class Codes: B81B 2203/0315 Cavities
• CPC Class Codes: B81C 1/00484 Processes for releasing structures not provided for in group B81C1/00476
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: H01G 5/40 Structural combinations of variable capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations

Abstract

A method for fabricating MEMS structure includes etching a recess in an upper surface of a substrate that is bonded to a wafer that ultimately forms the MEMS structure. Accordingly, once the etching processes of the wafer are completed, the recess facilitates the release of an internal movable structure within the fabricated MEMS structure without the use of a separate sacrificial material.

Claims

1. A method of fabricating a MEMS structure, comprising the steps of:

(a) forming a recess in an upper surface at a substrate;

(b) attaching an etchable wafer to the upper surface of the substrate, including a wafer portion from which a movable structure will be formed, the wafer portion being positioned over the recess; and

(c) etching downward in the wafer at a periphery of the wafer portion to break through in to the recess, thereby releasing at least part of the movable structure from the substrate without the need for substantial undercutting

wherein step (c) creates a first stationary conductive element and a variable size gap between the movable structure and the stationary conductive element.

2. The method us recited in claim 1, further comprising depositing a conductive layer onto the wafer.

3. The method as recited in claim 2, further comprising depositing a protective layer onto an upper surface of the conductive layer.

4. The method as recited in claim 2, wherein the conductive layer is selected from the group consisting of aluminum, copper, silver, gold and nickel.

5. The method as recited in claim 3, wherein the protective layer is selected from the group consisting of silicon dioxide and silicon nitride.

6. The method as recited in claim 1, wherein the wafer is selected from the group consisting of silicon, silicon carbide and gallium arsenide.

7. The method as recited in claim 1, wherein the substrate is a non-conductive substrate selected from the group consisting of glass, high resistivity silicon, crystalline sapphire, and ceramic.

8. The method as recited in claim 1, wherein the substrate is a conductive substrate selected from the group consisting of silicon, silicon carbide, and gallium arsenide.

9. The method as recited in claim 1, wherein the recess has beveled edges.

10. The method as recited in claim 1, further comprising the step of forming an intermediate layer between the stationary conductive element and the substrate, wherein the intermediate layer is selected from the group consisting of silicon, poly-crystalline silicon, amorphous silicon, silicon carbide and gallium arsenide.

11. The method as recited in claim 1, further comprising the step of forming a base layer that forms a lower surface of the movable structure.

12. The method as recited in claim 11, wherein the base layer is selected from the group consisting of silicon dioxide and silicon nitride.

13. The method as recited in claim 1, wherein the recess has beveled outer edges.

14. The method as recited in claim 1, wherein step (c) further comprises forming a second stationary conductive element extending outwardly from the substrate, wherein the movable structure is disposed between the first and second stationary conductive elements.

15. The method as recited in claim 14, wherein the first and second stationary conductive elements are electrically isolated from each other.

16. The method as recited in claim 11, wherein the base layer is insulating.

17. A method of fabricating a MEMS structure, comprising the steps of:

(a) forming a recess in an upper surface of a substrate;

(b) attaching an etchable wafer to the upper surface of the substrate, including a wafer portion from which a movable structure will be formed, the wafer portion being positioned over the recess; and

(c) etching downward in the wafer at a periphery of the wafer portion to break through in to the recess, thereby releasing at least part of the movable structure from the substrate and forming a base layer that forms a lower surface of the movable structure without the need fur substantial undercutting.

18. The method as recited in claim 17, further comprising depositing a conductive layer onto the wafer.

19. The method as recited in claim 18, further comprising depositing a protective layer onto an upper surface of the conductive layer.

20. The method as recited in claim 18, wherein the conductive layer is selected from the group consisting aluminum, copper, silver, gold and nickel.

21. The method as recited in claim 19, wherein the protective layer is selected from the group consisting of silicon dioxide and silicon nitride.

22. The method as recited in claim 17, wherein the wafer is selected from the group consisting of silicon, silicon carbide and gallium arsenide.

23. The method as recited in claim 17, wherein the substrate is a non-conductive substrate selected from the group consisting of glass, high resistivity silicon, crystalline sapphire, and ceramic.

24. The method as recited in claim 17, wherein the substrate is a conductive substrate selected from the group consisting of silicon, silicon carbide, and gallium arsenide.

25. The method as recited in claim 17, wherein the recess has beveled edges.

26. The method as recited in claim 17, wherein step (c) further comprises forming a first stationary conductive element extending outwardly from the substrate.

27. The method as recited in claim 26, wherein step (c) further comprises forming a variable size gap between the movable structure and the stationary conductive element.

28. The method as recited in claim 26, further comprising the step of forming an intermediate layer between the stationary conductive element and the substrate, wherein the intermediate layer is selected from the group consisting of silicon, poly-crystalline silicon, amorphous silicon, silicon carbide and gallium arsenide.

29. The method as recited in claim 17, wherein the base layer is selected from the group consisting of silicon dioxide and silicon nitride.

30. The method as recited in claim 17, wherein the recess has beveled outer edges.

31. The method as recited in claim 26, wherein step (c) further comprises forming a second stationary conductive element extending outwardly from the substrate, wherein the movable structure is disposed between the first and second stationary conductive elements.

32. The method as recited in claim 31, wherein the first and second stationary conductive elements are electrically isolated from each other.

33. The method as recited in claim 17, wherein the base layer is insulating.

34. A method of fabricating a MEMS structure, comprising the steps of:

(a) forming a recess in an upper surface of a substrate;

(b) attaching an etchable wafer to the upper surface of the substrate, including a wafer portion from which a movable structure will be formed, the wafer portion being positioned over the recess; and

(c) etching downward in the wafer at a periphery of the wafer portion to break through in to the recess, thereby releasing at least part of the movable structure from the substrate, and forming first and second stationary conductive elements extending outwardly from the substrate, wherein the movable structure is disposed between the first and second stationary conductive elements, without the need for substantial undercutting.

35. The method as recited in claim 34, further comprising depositing a conductive layer onto the wafer.

36. The method as recited in claim 35, further comprising depositing a protective layer onto an upper surface of the conductive layer.

37. The method as recited in claim 35, wherein the conductive layer is selected from the group consisting of aluminum, copper, silver, gold and nickel.

38. The method as recited in claim 36, wherein the protective layer is selected from the group consisting of silicon dioxide and silicon nitride.

39. The method as recited in claim 34, wherein the wafer is selected from the group consisting of silicon, silicon carbide and gallium arsenide.

40. The method as recited in claim 34, wherein the substrate is a non-conductive substrate selected from the group consisting of glass, high resistivity silicon, crystalline sapphire, and ceramic.

41. The method as recited in claim 34, wherein the substrate is a conductive substrate selected from the group consisting of silicon, silicon carbide, and gallium arsenide.

42. The method as recited in claim 34, wherein the recess has beveled edges.

43. The method as recited in claim 34, wherein step (C) further comprises forming a variable size gap between the movable structure and the stationary conductive element.

44. The method as recited in claim 35, further comprising the step of forming an intermediate layer between the stationary conductive element and the substrate, wherein the intermediate layer is selected from the group consisting of silicon, poly-crystalline silicon, amorphous silicon, silicon carbide and gallium arsenide.

45. The method as recited in claim 34, further comprising the step of forming a base layer that forms a lower surface of the movable structure.

46. The method as recited in claim 45, wherein the base layer is selected from the group consisting of silicon dioxide and silicon nitride.

47. The method as recited in claim 34, wherein the recess has beveled outer edges.

48. The method as recited in claim 34, wherein the first and second stationary conductive elements are electrically isolated from each other.

49. The method as recited in claim 46, wherein the base layer is insulating.