Method and apparatus for early detection of material accretion and peeling in plasma system

• US 6,815,653 B2
• Filed: 04/15/2002
• Issued: 11/09/2004
• Est. Priority Date: 04/15/2002
• Status: Expired due to Fees

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Tsay, Jenq-Yann, Chuang, Jeng-Chiang, Hsu, Yung-Mao, Yen, Chih-Pen
• Primary Examiner(s): Luu, Thanh X.
• Assistant Examiner(s): YAM, STEPHEN K
• Application Number:
  US10/122,687
• Publication Number:
  US 20030193010A1
• Time in Patent Office: 939 Days
• Field of Search: 250/206, 250/221, 250/573, 250/574, 156/345-3-3, 216/58-60, 438/706, 438/710, 118/715, 118/716, 134/1.1, 134/1.2
• US Class Current: 250/206
• CPC Class Codes: C23C 16/4401 Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
• CPC Class Codes: G01J 3/443 Emission spectrometry
• CPC Class Codes: G01N 2021/8411 Application to online plant, process monitoring
• CPC Class Codes: G01N 2021/8427 Coatings
• CPC Class Codes: G01N 21/55 Specular reflectivity
• CPC Class Codes: H01J 2237/0225 Detecting or monitoring foreign particles
• CPC Class Codes: H01J 37/32431 Constructional details of the reactor

Abstract

A method and apparatus for detecting material accretion and peeling in a system such as a plasma process chamber, including multiple optical sensors which are provided in the chamber above a gas distribution plate or other surface inside the chamber. The optical sensors are connected to a central process controller that is capable of terminating operation of the chamber and may be equipped with an alarm. In the event that the optical sensors detect asymmetries in brightness or light reflection among various portions or regions of the gas distribution plate or other surface, which asymmetries may indicate the formation of a material coating on the plate or dislodging of contaminant particles from the plate, a signal is sent to the process controller, which may be adapted to terminate the plasma process, alert operating personnel, or both.

Claims

1. An apparatus for detecting material accretion and peeling in a system, comprising:

a plasma process chamber having a chamber interior for containing processing operations and comprising a gas distribution plate in said chamber interior;

a plurality of optical sensors provided in said plasma process chamber in light receiving relationship with respect to light reflected from said gas distribution plate for monitoring relative brightness between various regions of said gas distribution plate; and

an alarm operably connected to said plurality of optical sensors for activation by said plurality of optical sensors when said relative brightness varies by at least about 1%.

2. The apparatus of claim 1 further comprising a lid provided on said chamber and wherein said plurality of optical sensors are provided in said lid.

3. The apparatus of claim 1 wherein said relative brightness varies by about 3%-10%.

4. An apparatus for detecting material accretion and peeling in a system, comprising:

a chamber having a chamber interior for containing processing operations and comprising a surface in said chamber interior;

said chamber comprises a plasma process chamber and said surface comprises a gas distribution plate;

a process controller operably connected to said chamber for terminating said processing operations in said chamber interior; and

a plurality of optical sensors provided in said chamber, said plurality of optical sensors arranged in at least two generally concentric circles and operably connected to said process controller for monitoring relative brightness between various regions of said surface and activating said process controller when said relative brightness varies by at least about 1%.

5. The apparatus of claim 4 further comprising a lid provided on said chamber and wherein said plurality of optical sensors are provided in said lid.

6. The apparatus of claim 4 further comprising an alarm operably connected to said plurality of optical sensors for activation by said plurality of optical sensors when said relative brightness varies.

7. The apparatus of claim 4 wherein said relative brightness varies by about 3%-10%.

8. The apparatus of claim 4 further comprising a lid provided on said chamber and wherein said plurality of optical sensors are provided in said lid.

9. The apparatus of claim 4 further comprising an alarm operably connected to said plurality of optical sensors for activation by said plurality of optical sensors when said relative briqhtness varies.

10. The apparatus of claim 4 wherein said relative brightness varies by about 3%-10%.

11. A method for detecting material accretion and peeling in a system, comprising the steps of:

providing a plasma process chamber having a chamber interior for containing processing operations and comprising a gas distribution plate in said chanter interior;

providing a plurality of optical sensors in at least two generally concentric circles in said chamber for monitoring relative brightness between various regions of said gas distribution plate;

operably connecting a process controller to said chamber and said plurality of optical sensors;

reflecting light from said gas distribution plate to said plurality of optical sensors; and

transmitting a signal from said plurality of optical sensors to said process controller when said relative brightness varies by at least about 1% to terminate said processing operations.

12. The method of claim 11 further comprising providing a lid on said chamber and wherein said plurality of optical sensors are provided in said lid.

13. The method of claim 11 further comprising operably connecting an alarm to said chamber and transmitting a signal from said plurality of optical sensors to said alarm when said relative brightness varies.

14. The method of claim 11 wherein said relative brightness varies by about 3%-10%.