Method to prevent damage to probe card

• US 6,819,132 B2
• Filed: 12/20/2002
• Issued: 11/16/2004
• Est. Priority Date: 06/25/2001
• Status: Expired due to Fees

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Byrd, Phillip E.
• Primary Examiner(s): Cuneo, Kamand
• Assistant Examiner(s): HOLLINGTON, JERMELE M
• Application Number:
  US10/327,468
• Publication Number:
  US 20030122570A1
• Time in Patent Office: 697 Days
• Field of Search: 324/765, 324/763, 324/760, 324/758, 324/754
• US Class Current: 324/754.07
• CPC Class Codes: G01R 1/06766 Input circuits therefor
• CPC Class Codes: G01R 1/07371 using an intermediate card or back card with apertures through which the probes pass
• CPC Class Codes: G01R 1/36 Overload-protection arrangements or circuits for electric measuring instruments
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: H05K 1/0293 Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 1/167 incorporating printed resistors
• CPC Class Codes: H05K 2201/068 wherein the coefficient of thermal expansion is important
• CPC Class Codes: H05K 2201/10053 Switch
• CPC Class Codes: H05K 2201/10181 Fuse
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49005 Acoustic transducer
• CPC Class Codes: Y10T 29/49107 Fuse making
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49139 by inserting component lead or terminal into base aperture
• CPC Class Codes: Y10T 29/49147 Assembling terminal to base
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49204 : Contact or terminal manufacturing

Abstract

Probe cards are configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. Protective fuses are provided in electrical communication with conductive traces and probe elements (e.g., probe needles) of a probe card. The fuses may be active or passive fuses and are preferably self-resetting, repairable, and/or replaceable. Typically, the fuses will be interposed in, or located adjacent to, conductive traces residing over a surface of the probe card. Methods of fabricating a probe card are provided, as well as various probe card configurations. A semiconductor die testing system using the probe card is also provided.

Claims

1. A method of using a probe card for testing at least one semiconductor die, comprising:

providing the probe card having a plurality of probe elements connected thereto, the plurality of probe elements configured for supplying test signals to the at least one semiconductor die;

providing a plurality of fuses in electrical communication with at least some of the plurality of probe elements, at least one of the plurality of fuses comprising a polymer positive temperature coefficient fuse, each polymer positive temperature coefficient fuse having a crystalline phase and a semi-crystalline phase; and

testing the at least one semiconductor die by supplying test signals to the at least one semiconductor die through a fuse of the plurality of fuses.

2. The method of claim 1, further comprising repairing or replacing a fuse of the plurality of fuses if the fuse has been tripped by a test signal.

3. The method of claim 2, wherein the replacing the fuse comprises inserting a new fuse in through-hole portions of a surface of the probe card.

4. The method of claim 2, wherein the repairing the fuse comprises forming new portions of the fuse by a deposition technique.

5. A method of testing, comprising:

providing a probe card having a plurality of probe elements connected thereto, the plurality of probe elements configured for supplying test signals to at least one semiconductor die;

providing a plurality of fuses in electrical communication with at least some of the plurality of probe elements, at least one of the plurality of fuses comprising a polymer positive temperature coefficient fuse, each polymer positive temperature coefficient fuse having a crystalline phase and a semi-crystalline phase; and

testing the at least one semiconductor die by supplying test signals to the at least one semiconductor die through a fuse of the plurality of fuses.

6. The method of claim 5, further comprising repairing or replacing a fuse of the plurality of fuses if the fuse has been tripped by a test signal.

7. The method of claim 6, wherein the replacing the fuse comprises inserting a new fuse in through-hole portions of a surface of the probe card.

8. The method of claim 6, wherein the repairing the fuse comprises forming new portions of the fuse by a deposition technique.