Six-axis force sensor

• US 6,823,744 B2
• Filed: 01/10/2003
• Issued: 11/30/2004
• Est. Priority Date: 01/11/2002
• Status: Expired due to Term

• Current Assignee: Honda Giken Kogyo Kabushiki Kaisha (Honda Motor Company)
• Original Assignee: Honda Giken Kogyo Kabushiki Kaisha (Honda Motor Company)
• Inventors: Ohsato, Takeshi, Hirabayashi, Yusuke
• Primary Examiner(s): Lefkowitz, Edward
• Assistant Examiner(s): Miller, T
• Application Number:
  US10/339,496
• Publication Number:
  US 20030140713A1
• Time in Patent Office: 690 Days
• Field of Search: 738/620.41, 738/620.44, 738/620.45
• US Class Current: 73/862.041
• CPC Class Codes: G01L 5/162 of piezoresistors

Abstract

A six-axis force sensor 1 consists of a sensor chip having a six-axis force sensor function formed using a semiconductor substrate 2 and film-forming technology. Connecting parts 5A to 5D are each made up of a high-rigidity bridge part and a low-rigidity elastic part. Semiconductor strain resistance devices Sya1-Sya3, Syb1-Syb3, Sxa1-Sxa3, and Sxb1-Sxb3 consisting of active layers are disposed on the front sides of the connecting parts. The elastic parts of the connecting parts absorb excess strains acting on the connecting parts and suppress the occurrence of strain spread over the whole semiconductor substrate. Because forces and moments of six specified axis components cause strains to occur selectively in corresponding strain resistance devices, by suitably combining measured results from selected resistance devices it is possible to effectively separate an applied external force into six components of force and moment and greatly suppress other axis interference in the measured results. As a results, six components of force and moment of an external force can be measured with good reproducibility on the basis of the strains arising in the resistance devices disposed on the connecting parts.

Claims

1. A six-axis force sensor comprising a thin plate-shaped sensor chip formed using a semiconductor substrate by semiconductor film-forming processes and having a six-axis force sensor function, the sensor chip comprising an action part to which an external force is applied, a support part to be fixed to an external structure, and a plurality of connecting parts each connecting together the action part and the support part and having a bridge part joined to the action part and an elastic part joined to the support part, wherein each of the connecting parts has a plurality of strain resistance devices each comprising an active layer formed on at least one of front and rear faces thereof in an area thereof where deformation strain effectively arises and each electrically connected to corresponding electrodes disposed in the support part, and wherein the connecting parts each have a generally T-shaped configuration formed by the elastic part and the bridge part of each connecting part, the elastic part having opposite ends jointed with the support part, the bridge parts of the respective connecting parts have a width smaller than a width of the action part and are each reduced in width to form a narrowed part located adjacent to a joining portion between each bridge part and the action part, and the strain resistance devices are arranged in sets of plural strain resistance devices, each set being disposed only on that portion of the bridge part of one connecting part including the narrowed part, the sets of strain resistance devices being arranged symmetrically with each other about a center of the action part and spaced at substantially equal distances from the center of the action part.

2. A six-axis force sensor according to claim 1, wherein the connecting parts are disposed around the action part with uniform spacing and so that adjacent connecting parts are mutually perpendicular.

3. A six-axis force sensor according to claim 1, wherein the action part is square and each of the connecting parts of generally T-shaped configuration is disposed at a respective one of the four sides of the action.

4. A six-axis force sensor according to claim 1, wherein the strain resistance devices in each set are disposed on the bridge part of the respective connecting part in parallel with the length direction of the bridge part and arranged side by side in a line in a direction perpendicular to the length direction of the bridge part.

5. A six-axis force sensor according to claim 1, wherein a resistance device for temperature compensation is provided on the support part.

6. A six-axis force sensor according to claim 1, wherein a guard interconnection at a ground potential is provided so as to surround a non-ground interconnection of a strain resistance device.

7. A six-axis force sensor according to claim 1, wherein a bias electrode for applying a bias potential is formed on the substrate.

8. A six-axis force sensor according to claim 1, wherein at least one of the strain resistance devices is disposed on the rear side of the substrate in an area corresponding to an area on the front side of the substrate where strain resistance devices are disposed on one of the bridge parts.

9. A six-axis force sensor according to claim 1, wherein the sensor chip has a plurality of elongated hole extending along and defined partly by the elastic parts of the respective connecting parts.

10. A six-axis force sensor according to claim 1, wherein the strain resistance device comprise twelve strain resistance devices disposed in sets of three, each set being disposed on one of the connecting parts of generally T-shaped configuration.

11. A six-axis force sensor comprising:

a thin plate-shaped sensor chip formed using a semiconductor substrate by semiconductor film-forming processes and having a six-axis force sensor functions, the sensor chip comprising an action part for receiving an external force, a support part supporting the action part and a plurality of connecting parts each connecting together the action part and the support part and having a bridge part joined to the action part and an elastic part joined to the support part, each of the connecting parts having a plurality of strain resistance devices each comprising an active layer formed on at least one of front and rear faces thereof in an area where deformation strain effectively arises and each electrically connected to corresponding electrodes disposed in the support part, the connecting parts each have a generally T-shaped configuration formed by the elastic part and the bridge part of each connecting part, the elastic part having opposite ends jointed with the support part, the bridge parts of the respective connecting parts have a width smaller than a width of the action part and are each reduced in width to form a narrowed part located adjacent to a joining portion between each bridge part and the action part, and the strain resistance devices are arranged in sets of plural strain resistance devices, each set being disposed only on that portion of the bridge part of one connecting part including the narrowed part, the sets of strain resistance devices being arranged symmetrically with each other about a center of the action part and spaced at substantially equal distances from the center of the action part; and

a structural body provided around the sensor chip and comprising an external force application part to which an external force is applied, a plinth part for supporting the sensor chip, an external force buffering mechanism fixing the external force application part to the plinth part, and an external force transmitting part.

12. A six-axis force sensor according to claim 11, wherein an insulating member is provided between the sensor chip and the plinth part.

13. A six-axis force sensor according to claim 12, further comprising an insulating member disposed between the external force transmitting part and the action part of the sensor chip.

14. A six-axis force sensor according to claim 11, further comprising an insulating member disposed between the external force transmitting part and the action part of the sensor chip.