Interconnection element with contact blade

• US 6,825,422 B2
• Filed: 06/17/2002
• Issued: 11/30/2004
• Est. Priority Date: 11/10/1998
• Status: Expired due to Term

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Madsen, Alec, Mathieu, Gaetan L., Eldridge, Benjamin N., Grube, Gary W., Khandros, Igor Y.
• Primary Examiner(s): Zarneke, David A.
• Assistant Examiner(s): PATEL, ISHWARBHAI B
• Application Number:
  US10/174,455
• Publication Number:
  US 20030015347A1
• Time in Patent Office: 897 Days
• Field of Search: 174/260, 174/267, 361/760, 361/769, 361/772, 361/773, 361/774, 361/776, 257/785, 257/780, 438/117, 439/81, 439/66, 439/83, 439/862
• US Class Current: 174/260
• CPC Class Codes: G01R 1/06711 Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
• CPC Class Codes: G01R 1/06727 Cantilever beams
• CPC Class Codes: H01R 12/00 Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures printed connections to, or between, printed circuits H05K1/11
• CPC Class Codes: H01R 12/57 surface mounting terminals
• CPC Class Codes: H01R 13/2407 characterized by the resilient means
• CPC Class Codes: H01R 13/2442 with a single cantilevered beam
• CPC Class Codes: H01R 2201/20 for testing or measuring purposes
• CPC Class Codes: H01R 4/26 Connections in which at least one of the connecting parts has projections which bite into or engage the other connecting part in order to improve the contact H01R4/188, H01R4/203, H01R4/5075 take precedence; using shape memory materials H01R4/01
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.

Claims

1. An apparatus comprising:

a substrate;

an interconnect element disposed on said substrate;

a tip structure disposed at an end of said interconnect element, said tip structure comprising a blade oriented such that a length of said blade is within approximately 745 degrees of an axis parallel to a wiping motion of said tip structure.

2. The apparatus of claim 1, wherein said tip structure is integrally formed with said interconnect element.

3. The apparatus of claim 1, wherein said tip structure comprises a foot, and said blade is disposed on said foot.

4. The apparatus of claim 1, wherein said tip structure further comprises a plurality of said blades.

5. The apparatus of claim 4, wherein said plurality of blades are spaced one from another.

6. The apparatus of claim 4, wherein said tip structure further comprises a bridge disposed between a pair of said plurality of blades.

7. The apparatus of claim 4, wherein said plurality of blades comprises a primary blade and a secondary blade.

8. The apparatus of claim 7, wherein said primary blade and said secondary blade are different sizes.

9. The apparatus of claim 1, wherein said tip structure further comprises a stand off, and said blade is disposed on said stand off.

10. The apparatus of claim 1, wherein said blade is a pyramid shape.

11. The apparatus of claim 1, wherein said blade is a truncated pyramid shape.

12. The apparatus of claim 1, wherein said blade is a diamond shape.

13. The apparatus of claim 1, wherein said interconnect element comprises a wire.

14. The apparatus of claim 13, wherein said interconnect element further comprises a shell over said wire.

15. The apparatus of claim 1, wherein said interconnect element comprises a Cobra probe.

16. The apparatus of claim 1, wherein said interconnect element is resilient.

17. The apparatus of claim 1, wherein said blade comprises a sharpened edge along said length thereof.

18. The apparatus of claim 1, further comprising:

a plurality of said interconnect elements; and

a plurality of said tip structures.

19. The apparatus of claim 1, wherein said tip structure comprises a first material comprising at least one of palladium, cobalt, rhodium, tungsten, or diamond.

20. The apparatus of claim 19, wherein said tip structure comprises a second material comprising a spring alloy.

21. The apparatus of claim 19, said tip structure comprises a second material comprising nickel.

22. The apparatus of claim 1, wherein said tip structure is secured to said interconnect element by one of braze or solder.