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Encapsulant for opto-electronic devices and method for making it

  • US 6,841,888 B2
  • Filed: 06/04/2003
  • Issued: 01/11/2005
  • Est. Priority Date: 06/04/2003
  • Status: Expired due to Fees
First Claim
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1. An encapsulant for an opto-electronic device or optical component, the encapsulant characterized by a coefficient of thermal expansion and an optical transmittance, the encapsulant comprising:

  • 1) a filler consisting essentially of glass particles having diameters in the range of 1 μ

    m to 500 μ

    m, the glass particles formed from a glass essentially free of titania and characterized by a glass refractive index having a value in the range of 1.48 to 1.60 and a variance of less than about 0.001, wherein the filler is characterized by a filler refractive index; and

    2) an epoxy, characterized by an epoxy refractive index;

    wherein the coefficient of thermal expansion of the encapsulant has an average value of less 50 ppm/°

    C., with a variation of less than ±

    30%, and wherein the filler refractive index and the epoxy refractive index have values sufficiently similar such that the optical transmittance of the encapsulant is at least 65% when measured at a wavelength in the range of 300 nm to 800 nm at an encapsulant thickness of about 1 mm.

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