Solder bump fabrication method and apparatus

  • US 6,843,407 B2
  • Filed: 07/25/2002
  • Issued: 01/18/2005
  • Est. Priority Date: 10/12/2001
  • Status: Active Grant
First Claim
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1. A method for preventing short circuiting of solder bumps in chip-on-board technology, comprising:

  • (a) providing a chip-on-board printed circuit board having a plurality of devices; and

    (b) forming a material on the chip-on-board printed circuit board, wherein the material is disposed between pins of the devices so that the material prevents the devices from short circuiting due to the solder bumps.

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