Solder bump fabrication method and apparatus

  • US 6,843,407 B2
  • Filed: 07/25/2002
  • Issued: 01/18/2005
  • Est. Priority Date: 10/12/2001
  • Status: Active Grant
First Claim
Patent Images

1. A method for preventing short circuiting of solder bumps in chip-on-board technology, comprising:

  • (a) providing a chip-on-board printed circuit board having a plurality of devices; and

    (b) forming a material on the chip-on-board printed circuit board, wherein the material is disposed between pins of the devices so that the material prevents the devices from short circuiting due to the solder bumps.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×