Method of bonding sputtering target materials
First Claim
1. A method of forming sputtering targets, comprising:
- bonding a backing plate to a plurality of targets located in recesses in a top surface of a casement, wherein an exposed surface of said targets is bonded to said backing plate to form bonded targets; and
removing said casement from said bonded targets to retrieve said sputtering targets.
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Accused Products
Abstract
A method of forming a sputtering target is described that involves bonding a backing plate onto a casement having one or more recesses that contain target material to form a bonded target. During the bonding process, the bonded target is optionally vacuum sealed within the recess. The bonded target is then optionally annealed while under vacuum to form an annealed sputtering target. The sputtering target can then be retrieved by removing at least a portion of the casement from the sputtering target in one or several steps. Also described is a casement having one or more recesses containing bonded target material that is optionally vacuum sealed in the casement. The casement, as well as the backing plate that is optionally bonded onto the casement, are further described as well as other options and methods.
57 Citations
72 Claims
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1. A method of forming sputtering targets, comprising:
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bonding a backing plate to a plurality of targets located in recesses in a top surface of a casement, wherein an exposed surface of said targets is bonded to said backing plate to form bonded targets; and
removing said casement from said bonded targets to retrieve said sputtering targets. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 68)
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37. A method of forming a sputtering target, comprising:
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bonding a backing plate to a target located in a recess in a top surface of a casement, wherein an exposed surface of said target is bonded to said backing plate to form a bonded target that is vacuum sealed within said recess;
annealing said bonded target to form an annealed bonded target; and
removing at least a portion of said casement from said annealed bonded target to retrieve said sputtering target. - View Dependent Claims (38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 69)
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70. A method of forming a bonded metal article, comprising:
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bonding a backing plate to a metal article located in a recess in a top surface of a casement, wherein an exposed surface of said metal article is bonded to said backing plate to form a bonded metal article that is vacuum sealed within said recess;
annealing said bonded metal article to form an annealed bonded article; and
removing at least a portion of said casement from said annealed bonded article to retrieve said bonded metal article. - View Dependent Claims (71, 72)
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Specification