Flat mount with at least one semiconductor chip
First Claim
1. A flat mount assembly, comprising a flat mount, at least one semiconductor chip in or on said flat mount, an antenna formed of two electrical conductors connected to said at least one semiconductor chip for interchanging data and power with an electronic apparatus, and a conductive layer disposed on said mount and overlapping said electrical conductors of said antenna for improving a capacitive coupling between said antenna and the electronic apparatus.
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Accused Products
Abstract
The flat mount assembly, or transponder, has at least one semiconductor chip that is connected to an antenna for interchanging data and power with an electronic apparatus. The antenna is formed of two electrical conductors. A conductive layer is formed on the mount in overlapping relationship with the electrical conductors of the antenna. The overlapping conductive layer results in greater capacitive coupling between the electronic apparatus and the flat mount assembly.
10 Citations
12 Claims
- 1. A flat mount assembly, comprising a flat mount, at least one semiconductor chip in or on said flat mount, an antenna formed of two electrical conductors connected to said at least one semiconductor chip for interchanging data and power with an electronic apparatus, and a conductive layer disposed on said mount and overlapping said electrical conductors of said antenna for improving a capacitive coupling between said antenna and the electronic apparatus.
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5. The flat mount assembly according to claim l, wherein said electrical conductors are embedded together with said semiconductor chip in said flat mount.
Specification