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Method and apparatus for probe sensor assembly

  • US 6,851,306 B2
  • Filed: 08/27/2002
  • Issued: 02/08/2005
  • Est. Priority Date: 08/27/2002
  • Status: Expired due to Fees
First Claim
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1. A sensor package comprising:

  • a sensor component for electromagnetic sensing, said sensor component including a sensor body having a sensor tip at one end;

    a sensor housing having a cavity for receiving said sensor component therein and a snap-fit interface with said sensor component, said interface configured to admit and secure said sensor tip therein, said housing disposed in a substrate and is aligned with an object to be sensed; and

    a bracket mechanically fixable to said substrate at a first end and in operable communication with said sensor tip at a second end, said bracket configured to bias said sensor tip towards said object to be sensed for elimination of an internal air gap between said sensor tip and housing formed during assembly thereof.

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