Elastomeric interconnection device and methods for making same
DCFirst Claim
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1. An elastomeric device for electrically interconnecting two or more components, comprising:
- an elastomeric matrix having one or more outer surfaces;
a plurality of electrically conductive pathways through said matrix, the pathways each comprising a plurality of particles; and
a plurality of electrically conductive contact pads integral with said matrix, said pads each in electrical contact with a plurality of conductive pathways, wherein at least a portion of one or more of said is flush with or extends outward from an outer surface of said matrix.
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Abstract
An elastomeric device for interconnecting two or more electrical components, comprising, an elastomeric matrix having one or more outer surfaces; one or more electrically conductive pathways through the matrix; and one or more electrically conductive contact pads, wherein at least a portion of one or more of the pads is flush with or extends outward from one or more of the outer surfaces of the matrix, and wherein at least a portion of the pad is in at least intimate contact with one or more of the pathways; and methods for making same.
131 Citations
59 Claims
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1. An elastomeric device for electrically interconnecting two or more components, comprising:
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an elastomeric matrix having one or more outer surfaces;
a plurality of electrically conductive pathways through said matrix, the pathways each comprising a plurality of particles; and
a plurality of electrically conductive contact pads integral with said matrix, said pads each in electrical contact with a plurality of conductive pathways, wherein at least a portion of one or more of said is flush with or extends outward from an outer surface of said matrix. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45)
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46. A method for making an elastomeric device for electrically interconnecting two or more components, comprises the steps of,
embedding a plurality of conductive, magnetic particles in an elastomer which retains 90% of its modulus of compression over a temperature range of between about − - 50°
C. to 200°
C. by mixing said particles in said elastomer before said elastomer sets and applying a magnetic force to said particles so that said particles align themselves in electrically isolated columns as the elastomer sets to form an elastomeric matrix having one or more outer surfaces and comprising one or more electrically conductive pathways through said matrix;
providing one or more electrically conductive contact pads; and
fixing one or more of said electrically conductive contact pads to said matrix, so that at least a portion of one or more of said pads is flush with or extends outward from one or more of said outer surfaces of said matrix and, so that at least a portion of said pad is in at least intimate contact with one or more of said pathways. - View Dependent Claims (47, 48, 49, 50, 51, 52, 53, 54, 55, 56)
- 50°
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57. A device package, wherein one or more chips and one or more components are electrically interconnected, comprising,
one or more layers of elastomeric material between said chip and said component, wherein at least one of said layers provide electrical contact between said chip and said component, and wherein said layer which provides electrical contact comprises, an elastomeric matrix having one or more outer surfaces; -
one or more electrically conductive pathways through said matrix; and
one or more electrically conductive contact pads, wherein at least a portion of said pad is in at least intimate contact with one or more of said pathways.
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58. A device package, wherein one or more chips and one or more heat sinks are interconnected so that heat may be transferred from said chip to said heat sink, comprising,
a can having a first and second opposing surface, wherein said first opposing surface is adjacent to said heat sink; -
a top layer of elastomeric material provided between said chip and said second opposing surface of said can, wherein said top layer provides thermal contact between said chip and said can;
a bottom layer of conducting elastomeric material between said chip and a lead frame, wherein said bottom layer provides electrical contact between said chip and said lead frame. - View Dependent Claims (59)
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Specification