Diode housing

• US 6,858,879 B2
• Filed: 07/09/2003
• Issued: 02/22/2005
• Est. Priority Date: 06/30/1998
• Status: Expired due to Term

• Current Assignee: OSRAM GmbH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Brunner, Herbert, Waitl, Gunther
• Primary Examiner(s): Fourson, George
• Assistant Examiner(s): Estrada, Michelle
• Application Number:
  US10/616,070
• Publication Number:
  US 20040104445A1
• Time in Patent Office: 594 Days
• Field of Search: 257/99, 257 79-103, 257/434, 257/680
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01058 Cerium [Ce]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas. By minimizing the area of the conductor exposed to the window, delamination brought about by the different thermal expansions of the window and conductor are minimized and/or eliminated. Likewise, with a reflective housing covering the base of the cavity that accommodates the window, internal radiation reflection is increased over that which was achieved with an exposed conductor.

Claims

1. An electromagnetic radiation emitting or receiving surface mountable semiconductor device, comprising:

a housing including an opening with an open top, a closed bottom and sides connecting said closed bottom and said open top and a bottom wall at the closed bottom;

a conductor accommodated within said housing, said conductor having at least one first conductor portion and at least one second conductor portion being electrically isolated from each other;

at least one semiconductor chip positioned within said opening; and

a wire having a first wire end bonded to said at least one semiconductor chip and a second wire end bonded to said at least one second conductor portion such that said wire is positioned within said opening;

wherein

said opening forms a window for sending or receiving electromagnetic radiation;

said first conductor portion has a first conductor end terminating in a first electrode external to said housing and a second conductor end extending along said opening and having a first open area exposed along said closed bottom such that said first conductor portion is substantially surrounded by said housing but for said first electrode and said first open area;

said second conductor portion has a third conductor end terminating in a second electrode external to said housing and a fourth conductor end extending along said opening and having a second open area exposed along said closed bottom such that said second conductor portion is substantially surrounded by said housing but for said second electrode and said second open area;

said bottom wall is positioned between said closed bottom and said second and fourth conductor ends such that said first and second open areas remain exposed;

said at least one semiconductor chip is bonded to said first open area; and

said second wire end is bonded to said second open area.

2. The semiconductor device according to claim 1, wherein said first and second open areas are the only parts of said first and second conductor portions that are exposed within said opening.

3. The semiconductor device according to claim 1, wherein said first and second conductor portions are coplanar.

4. The semiconductor device according to claim 1, wherein said second and fourth conductor ends are in a first plane and said first and second open areas are in a second plane.

5. The semiconductor device according to claim 1, wherein said second and fourth conductor ends are in a first plane and said first and second electrodes are in a second plane.

6. The semiconductor device according to claim 1, wherein said housing is made of a reflective material wherein at least said closed bottom is reflective for said radiation.

7. The semiconductor device according to claim 6, wherein said reflective material features a diffuse reflective degree of at least 80%.

8. The semiconductor device according to claim 1, wherein said first and second electrodes wrap around a portion of said housing.

9. The semiconductor device according to claim 8, wherein said first and second electrodes terminate on an external rear side of said housing which does not face the said window.

10. The semiconductor device according to claim 1, wherein said second conductor end features a first offset comprising said first open area and said fourth conductor end features a second offset comprising the second open area.

11. The semiconductor device according to claim 10, wherein said first and second offsets are offset toward said opening.

12. The semiconductor device according to claim 4, wherein said second conductor end features a first offset comprising said first open area and said fourth conductor end features a second offset comprising the second open area.

13. The semiconductor device according to claim 12, wherein said first and second offsets are offset toward said opening.