Minimizing whisker growth in tin electrodeposits

  • US 6,860,981 B2
  • Filed: 04/30/2002
  • Issued: 03/01/2005
  • Est. Priority Date: 04/30/2002
  • Status: Expired due to Fees
First Claim
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1. A method for reducing tin whisker formation in a tin deposit, which comprises electroplating the tin deposit directly on an underlying metal comprising copper or a copper alloy, wherein the deposit is predominantly in a predetermined crystal orientation, measurable by X-ray diffraction, that essentially matches that of the underlying metal in order to inhibit tin whisker growth in the tin deposit.

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