Method for suppressing electromagnetic interference of electronic device and electronic device with suppressed electromagnetic interference by the method

• US 6,863,547 B2
• Filed: 05/01/2003
• Issued: 03/08/2005
• Est. Priority Date: 05/01/2003
• Status: Expired due to Fees

• Current Assignee: Averatec Asia Incorporation, Averatec Europe GmbH, Averatec Incorporated
• Original Assignee: Averatec Asia Incorporation
• Inventors: Park, Hee-Keun
• Primary Examiner(s): Gushi, Ross
• Assistant Examiner(s): TSUKERMAN, LARISA Z
• Application Number:
  US10/428,438
• Publication Number:
  US 20040219842A1
• Time in Patent Office: 677 Days
• Field of Search: 439/66, 439/76.1, 439/92, 439/95, 361/818, 361/816, 361679-681, 361/799, 361/800
• US Class Current: 439/95
• CPC Class Codes: G06F 1/182 with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
• CPC Class Codes: H01R 13/6582 with resilient means for engaging mating connector
• CPC Class Codes: H01R 13/6594 the shield being mounted on a PCB and connected to conductive members

Abstract

An electronic device, such as a notebook computer, includes a main board housed in a casing that is at least partly constituted by a conductive member. A grounding path is established between the main board and the casing by arranging a resilient grounding tab, made of a conductive material, between the main board and the casing. The grounding tab has a U- or V-shape including first and second limbs. The first limb is positioned on the main board with a free end of the second limb engaging the casing and maintaining secured engagement with the casing by means of elastic deformation thereof. The first limb has legs perpendicularly extending therefrom for inserting into through holes defined in the main board. The legs are soldered to the main board by through-hole techniques to fixedly mount the grounding tab to the main board. A secured grounding path is thus established between the main board and the casing for suppressing electromagnetic interference of the electronic device.

Claims

1. A method for suppressing electromagnetic interference of an electronic device comprising a main board housed in a casing having at least a conductive portion, the method comprising the following steps:

(1) forming through holes in the main board;

(2) providing a grounding tab comprising first and second sections connected to each other, the first section having legs perpendicularly extended from two opposite edges of the first section and the second section being resilient and forming a casing contact arm facing the first section;

(3) placing the first section on the main board by inserting the legs into the through holes of the main board with the second section directly above the first section and the casing contact arm engaging the casing; and

(4) soldering the legs to the main board;

wherein the first section forms a substantially rectangular slab lying on the main board between the legs.

2. The method as claimed in claim 1 wherein the first and second sections are connected to each other by a resilient connection portion and the grounding tab has a U-shape.

3. The method as claimed in claim 1, wherein the grounding tab has a V-shape.

4. The method as claimed in claim 1, before step (4) the method further comprising a step of inserting legs of an additional grounding tab into corresponding holes defined in the main board with a casing contact arm of the additional grounding tab engaging the casing.

5. The method as claimed in claim 1, wherein the legs of the grounding tab are soldered to the main board by means of through-hole techniques.

6. An electronic device comprising a conductive casing and a main board enclosed in the casing, a device for suppressing electromagnetic interference comprising a conductive body having a first section attached to the main board with legs perpendicularly extended from two opposite edges of the first section, the legs being received in corresponding through holes in the main board for electrical connection therewith, and a resilient second section extending from the first section, directly above and facing the first section and resiliently engaging the casing, wherein the first section forms a substantially rectangular slab lying on the main board between the legs.

7. The electronic device as claimed in claim 6, wherein the conductive body comprises a U-shaped configuration.

8. The electronic device as claimed in claim 6, wherein the conductive body comprises a V-shaped configuration.

9. The electronic device as claimed in claim 6, wherein the electronic device comprises a notebook computer.