Method for packaging an image sensor

• US 6,874,227 B2
• Filed: 06/03/2003
• Issued: 04/05/2005
• Est. Priority Date: 06/03/2003
• Status: Expired due to Fees

• Current Assignee: Kingpak Technology Inc.
• Original Assignee: Kingpak Technology Inc.
• Inventors: Tu, Hsiu-Wen, Chuang, Jason, Hsin, Chung Hsien, You, Irving
• Primary Examiner(s): Arbes, Carl J.
• Application Number:
  US10/454,649
• Publication Number:
  US 20040244192A1
• Time in Patent Office: 672 Days
• Field of Search: 298/25, 298/27, 298/32, 298/33, 298/40, 438/123, 438/124
• US Class Current: 29/832
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49131 by utilizing optical sighting device
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor

Abstract

A method for packaging an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer to the upper surface of the substrate to form a chamber together with the substrate; mounting a photosensitive chip to the upper surface of the substrate and within the chamber, and electrically connecting the photosensitive chip to the substrate; mounting a transparent layer to the frame layer with a B-stage adhesive applied therebetween; pre-baking the B-stage adhesive to slightly adhere the transparent layer to the frame layer; testing the image sensor to determine whether the image sensor is passed or failed; and post-baking the passed image sensor to completely cure the B-stage adhesive so that the transparent layer is firmly adhered to the frame layer.

Claims

1. A method for packaging an image sensor, comprising the steps of:

providing a substrate having an upper surface and a lower surface;

mounting a frame layer to the upper surface of the substrate to form a chamber together with the substrate;

mounting a photosensitive chip to the upper surface of the substrate and within the chamber, and electrically connecting the photosensitive chip to the substrate;

mounting a transparent layer to the frame layer with a B-stage adhesive applied therebetween;

pre-baking the B-stage adhesive to slightly adhere the transparent layer to the frame layer;

testing the image sensor to determine whether the image sensor is passed or failed; and

post-baking the passed image sensor to completely cure the B-stage adhesive so that the transparent layer is firmly adhered to the frame layer.

2. The method according to claim 1, wherein the upper surface of the substrate is formed with a plurality of first connection points electrically connected to the photosensitive chip.

3. The method according to claim 2, wherein the photosensitive chip is electrically connected to the first connection points of the substrate via a plurality of wires.

4. The method according to claim 1, wherein the lower surface of the substrate is formed with a plurality of second connection points.