Method of attaching a die to a substrate

  • US 6,875,635 B2
  • Filed: 03/29/2004
  • Issued: 04/05/2005
  • Est. Priority Date: 03/04/2002
  • Status: Expired due to Term
First Claim
Patent Images

1. A method of attaching an integrated circuit die to a base carrier comprising the steps of:

  • dispensing an adhesive material onto a central area of a top surface of the base carrier, wherein the central area is sized to receive the integrated circuit die and the central area is surrounded by a peripheral area; and

    attaching a bottom surface of the integrated circuit die to the central area on the top surface of the base carrier with the adhesive material, wherein the adhesive material dispensed onto the top surface of the base carrier extends beyond edges of the die a distance treater than about two times a thickness of the die.

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