In-built antenna for mobile communication device

• US 6,879,849 B2
• Filed: 02/21/2002
• Issued: 04/12/2005
• Est. Priority Date: 02/21/2002
• Status: Expired due to Term

• Current Assignee: Telefonaktiebolaget LM Ericsson
• Original Assignee: Telefonaktiebolaget LM Ericsson
• Inventors: Begic, Stjepan
• Primary Examiner(s): Nguyen, Lee
• Assistant Examiner(s): TRAN, TUAN A
• Application Number:
  US10/081,013
• Publication Number:
  US 20030157903A1
• Time in Patent Office: 1,146 Days
• Field of Search: 455/558, 455/575.1, 455/575.7, 455 901- 903, 455/575.5, 455/550.1, 455/554.2, 455/562.1, 455/128, 455/129, 343/700.MS, 343/702, 343/703, 343/850, 343/797, 343/746, 343/860
• US Class Current: 455/575.7
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/48 Earthing means; Earth screens; Counterpoises
• CPC Class Codes: H01Q 5/371 Branching current paths
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40

Abstract

An in-built antenna is provided for a mobile phone or other communication device having a main printed circuit board contained within a case, wherein components for transmitting and receiving radio signals are mounted on the main circuit board. An antenna pattern or radiator is etched on the printed circuit board surface mounting the components, in electrical connection with the components, using the same process employed to form the components and connections between them. A ground plane is mounted to the opposing surface of the main printed circuit board, in facing, spaced-apart parallel relationship with the antenna pattern and in spaced-apart parallel relationship with the main printed circuit board.

Claims

1. In a mobile communication device having a case and a main printed circuit board within the case for mounting electronic communication components, antenna apparatus comprising:

an antenna pattern formed of conductive material located on a specified planar surface of said main printed circuit board, an element of said antenna pattern extending to at least one of said communication components to provide a conductive path between said at least one component and said antenna pattern;

a ground plane formed of selected electrically conductive material; and

a mounting device for supporting said ground plane within said case in facing spaced-apart parallel relationship with said antenna pattern and in spaced-apart relationship with said main printed circuit board.

2. The apparatus of claim 1 wherein:

said antenna pattern is etched on said specified planar surface of said main printed circuit board.

3. The apparatus of claim 1 wherein:

said ground plane comprises a portion of a flexible sheet of conductive material, and an end portion of said flexible sheet is extended from said ground plane to said main printed circuit board.

4. The apparatus of claim 3 wherein:

said end portion of said flexible sheet joins said ground plane to the surface of said main printed circuit board opposing said specified surface.

5. The apparatus of claim 4 wherein:

said ground plane comprises a flexible printed circuit board.

6. The apparatus of claim 4 wherein:

said end portion is joined to said opposing surface of said main printed circuit board by means of heat sealing.

7. The apparatus of claim 4 wherein:

said end portion is joined to said opposing surface of said main printed circuit board by means of hot bar soldering.

8. The apparatus of claim 4 wherein:

said ground plane comprises a sheet metal part.

9. The apparatus of claim 4 wherein:

said ground plane comprises a metal plated plastic part.

10. The apparatus of claim 4 wherein:

said end portion is joined to said main printed circuit board by means of a conductive gasket.

11. The apparatus of claim 4 wherein:

an element of said antenna pattern defines a boundary thereof, and

said ground plane is electrically connected to said main printed circuit by means of a microstrip of conductive material joined to said opposing surface in closely spaced relationship with said element defining said antenna pattern boundary.

12. In a mobile communication device having a case and a main printed circuit board within the case for mounting electronic communication components, a method for configuring an antenna comprising the steps of:

forming an antenna pattern of conductive material on a specified planar surface of said main printed circuit board and extending an element of said pattern to at least one of said communication components; and

mounting a ground plane within said case in facing spaced-apart parallel relationship with said antenna pattern and in spaced-apart relationship with said main printed circuit board.

13. The method of claim 12 wherein:

said forming step comprises etching said antenna pattern on said specified planar surface of said main printed circuit board.

14. The method of claim 12 wherein:

said mounting step comprises positioning a mounting device between said ground plane and the surface of said main printed circuit board opposing said specified surface.

15. The method of claim 14 wherein:

said ground plane comprises a portion of a flexible printed circuit board.

16. The method of claim 15 wherein:

an end portion of said flexible circuit board is extended from said ground plane to said opposing surface of said main printed circuit board, and is joined thereto by means of heat sealing.

17. The method of claim 15 wherein:

an end portion of said flexible circuit board is extended from said ground plane to said opposing surface of said main printed circuit board, and is joined thereto by means of hot bar soldering.

18. The method of claim 15 wherein:

an end portion of said flexible circuit board is extended from said ground plane to connect said ground plane to said main printed circuit board by means of a conductive gasket.

19. The method of claim 14 wherein:

said ground plane comprises a sheet metal part.

20. The method of claim 14 wherein:

said ground plane comprises a metal plated plastic part.