Electronic component package
First Claim
1. A method of fabricating an electronic component package which includes a ceramic substrate, a plurality of bonding pads formed on the substrate, each pad forming an interface with the ceramic, a bonding material formed over the pads, and a plurality of electrical leads secured by the bonding material to corresponding pads, the method comprising the steps of:
- depositing an adhesive material over at least the interfaces between the pads and ceramic; and
bending the leads into a desired shape.
9 Assignments
0 Petitions
Accused Products
Abstract
An electronic component package and method of fabrication is provided. The electronic component package includes a ceramic substrate and a plurality of bonding pads formed on the substrate, each pad forming an interface with the ceramic. Formed on the bonding pads is a bonding material, and a plurality of electrical leads are secured to corresponding pads by the bonding material. A layer of adhesive is formed over at least the interfaces between the pads and ceramic.
6 Citations
9 Claims
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1. A method of fabricating an electronic component package which includes a ceramic substrate, a plurality of bonding pads formed on the substrate, each pad forming an interface with the ceramic, a bonding material formed over the pads, and a plurality of electrical leads secured by the bonding material to corresponding pads, the method comprising the steps of:
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depositing an adhesive material over at least the interfaces between the pads and ceramic; and
bending the leads into a desired shape. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification