Circuit chip connector and method of connecting a circuit chip

• US 6,891,110 B1
• Filed: 03/21/2000
• Issued: 05/10/2005
• Est. Priority Date: 03/24/1999
• Status: Expired due to Term

• Current Assignee: Motorola Solutions, Inc.
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Eberhardt, Noel H., Pennaz, Thomas J.
• Primary Examiner(s): Cuneo, K.
• Assistant Examiner(s): NORRIS, JEREMY C
• Application Number:
  US09/532,807
• Time in Patent Office: 1,876 Days
• Field of Search: 174/260, 174/261, 174/255, 361/767, 361/768, 361/771
• US Class Current: 174/260
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07752 using an interposer
• CPC Class Codes: G06K 19/07758 arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01L 2224/29011 comprising apertures or cavities
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/29101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29199 Material of the matrix
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29299 Base material
• CPC Class Codes: H01L 2224/293 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/838 Bonding techniques
• CPC Class Codes: H01L 2224/83851 being an anisotropic conductive adhesive
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits

Abstract

A radio frequency identification tag comprising a first substrate and a second substrate is disclosed. An antenna element is disposed on the first substrate, and a first contact pad and a second contact pad is disposed on the second substrate. A circuit is coupled to the first and second contact pads, and the first and second contact pads are designed to make electrical contact with the antenna element.

Claims

1. A radio frequency identification tag comprising:

a first substrate;

a first antenna element and a second antenna element disposed on the first substrate, wherein the first antenna element is electrically isolated from the second antenna element;

a second substrate;

a first contact pad and a second contact pad disposed on the second substrate wherein the first contact pad is electrically isolated from the second contact pad; and

a circuit coupled to the first and second contact pads,

wherein the first and second contact pads are designed to make electrical contact with the first and second antenna elements.

2. The RFID tag of claim 1 wherein a pattern of the first and second contact pads is selected from a group comprising butterfly, propeller, polygon and bow-tie patterns.

3. The RFID of claim 1 wherein a conductive adhesive is applied to at least a portion of the first and second contact pads.

4. The RFID tag of claim 1 wherein at least one of antenna element, first contact pad and second contact pad is printed.

5. The RFID tag of claim 1 wherein the circuit is electrically coupled to the first and second contact pads.

6. The RFID tag of claim 1 wherein the first contact pad is disposed on the second substrate diagonally from the second contact pad.

7. The RFID tag of claim 1 wherein the first and second contact pads are electrically isolated from each other.

8. The RFID tag of claim 1 wherein the first and second contact pads are physically separated from each other.

9. The RFID tag of claim 1 wherein at least one of the first and second contact pads is printed with a material selected from a group consisting of:

carbon and a metalized material.

10. The RFID tag of claim 1 wherein the antenna element is divided into a first half and a second half, and wherein the first contact pad is designed to make electrical contact with the first half of the antenna, and the second contact pad is designed to make electrical contact with the second half of the antenna.

11. A radio frequency identification tag comprising:

a first substrate;

an antenna element disposed on the first substrate;

a second substrate;

a first contact pad and a second contact pad disposed on the second substrate; and

a circuit coupled to the first and second contact pads,

wherein the first and second contact pads are designed to make electrical contact with the antenna element, and wherein the circuit is electrically coupled to the first and second contact pads via a pressure sensitive adhesive film.

12. An assembly comprising:

a first substrate having disposed thereon a first contact pad and a second contact pad, wherein the first and second contact pads are designed to couple to a first antenna element and a second antenna element; and

a second substrate overlaying the first substrate, the second substrate comprising an aperture,

wherein the aperture exposes at least a portion of the first contact pad and at least a portion of the second contact pad, and wherein the aperture is patterned such that it facilitates a placement of a circuit that couples to the first and second contact pads, and wherein the second substrate is designed to be removed from the first substrate prior to coupling the first and second contact pads to the first and second antenna elements, and wherein the first and second antenna elements are separate from the assembly.

13. The assembly of claim 12 wherein the second substrate adheres to the first substrate via an adhesive.