Light-receiving module

• US 6,900,512 B2
• Filed: 02/26/2003
• Issued: 05/31/2005
• Est. Priority Date: 02/27/2002
• Status: Expired due to Fees

• Current Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Original Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Inventors: Tanaka, Motoyoshi, Kohmoto, Kenichiro, Ito, Makoto, Sekiguchi, Takeshi
• Primary Examiner(s): Jackson, Jerome
• Assistant Examiner(s): NGUYEN, JOSEPH H
• Application Number:
  US10/373,186
• Publication Number:
  US 20030183894A1
• Time in Patent Office: 825 Days
• Field of Search: 257432-436, 257/692, 257/698, 257/775, 257/438, 2502141-214 R
• US Class Current: 257/435
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/30111 matching
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

This invention relates to a light-receiving module in which transmission impedance of lead terminals are matched by simple method. The module has a semiconductor light-receiving device, such as a photo diode, a plurality of lead terminals for transmitting an electrical signal converted by the semiconductor device, and a metal base with a plurality of through holes, the lead terminals passes therethrough. The diameter of the lead terminal for signal transmission is smaller as compared with that of other lead terminal and the diameter of the through holes is adjusted and filled by a sealant glass with a dielectric constant so as to match the impedance thereof.

Claims

1. A light-receiving module comprising:

a semiconductor light-receiving device for converting an optical signal to an electrical signal;

a first lead terminal for outputting the electrical signal converted by the semiconductor light-receiving device, the first lead terminal having a first diameter;

a second lead terminal for providing an power supply to the semiconductor light-receiving device, the second lead terminal having a second diameter greater than the first diameter; and

a metal body for installing the semiconductor light-receiving device thereon, the metal body having a plurality of through holes having an inner surface for passing the first lead terminal and the second lead terminal,

wherein the light-receiving module is sealed by filling up a sealant only in an opening between the first lead terminal and the inner surface of the through hole and between the second terminal and the inner surface of the through hole.

2. The light-receiving module according to claim 1, further includes a cylindrical member provided on the metal body, a portion of the first lead terminal protruding from the metal body being surrounded with the cylindrical member.

3. The light-receiving module according to claim 1, wherein the first lead terminal has a tip portion protruding from the metal body, the tip portion having a diameter greater than the first diameter.

4. The light-receiving module according to claim 1, wherein the first lead terminal is impedance matched at the through hole through which the first lead terminal passes.