Printed circuit board routing and power delivery for high frequency integrated circuits

• US 6,900,992 B2
• Filed: 09/18/2001
• Issued: 05/31/2005
• Est. Priority Date: 09/18/2001
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Kelly, Christopher J., Askew, Raymond P., Krieger, Jeffrey L.
• Primary Examiner(s): Cuneo, Kamand
• Assistant Examiner(s): DINH, TUAN T
• Application Number:
  US09/955,230
• Publication Number:
  US 20030053302A1
• Time in Patent Office: 1,351 Days
• Field of Search: 361772-784, 361792-795, 361/766, 361760-764, 361/816, 361/818, 257690-692, 257772-779, 333/12, 333/121, 333/33, 333/333, 333/246, 333/247, 174256-262
• US Class Current: 361/794
• CPC Class Codes: H05K 1/0233 Filters, inductors or a magnetic substance
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 2201/09336 Signal conductors in same plane as power plane
• CPC Class Codes: H05K 2201/09345 Power and ground in the same plane; Power planes for two voltages in one plane
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602

Abstract

A printed circuit board includes a signal layer and a supply voltage plane layer. The signal layer includes traces to communicate signals that are not associated with regulated supply voltages. The supply voltage plane is embedded in the signal layer to supply power to multiple supply voltage pins of a component that is mounted to the printed circuit board. The printed circuit board may also include a supply voltage plane layer to communicate a supply voltage. A ground plane may be embedded in the supply voltage plane layer to provide ground connections to multiple pins of the component.

Claims

1. A printed circuit board comprising;

a printed circuit board substrate;

a signal layer supported by the printed circuit board substrate, the signal layer comprising traces to communicate signals not associated with regulated supply voltages;

a supply voltage plane supported by the printed circuit board substrate, the supply voltage plane embedded in the signal layer to supply power to multiple supply voltage pins of a component mounted to the printed circuit board; and

a supply voltage plane layer different from the signal layer, the supply voltage plane layer comprising an embedded ground plane to provide ground connections for the signal layer.

2. The printed circuit board of claim 1, wherein the ground connections are associated with electrical devices connected to the component.

3. The printed circuit board of claim 1, wherein the ground plane has an outer boundary established by the ground connections.

4. The printed circuit board of claim 1, wherein the ground plane lies substantially within a region located directly below the component, the component being mounted on top of the signal layer.

5. The printed circuit board of claim 1, wherein the ground plane is significantly larger than the supply voltage plane.

6. The printed circuit board of claim 1, wherein the ground plane has an outer boundary that circumscribes a projection of the supply voltage plane onto the supply voltage plane layer.

7. The printed circuit board of claim 1, further comprising:

a core layer,

wherein the signal layer and the supply voltage plane layer are on the same side of the core layer.

8. The printed circuit board of claim 1, wherein the ground plane reduces an inductance.

9. A printed circuit board comprising:

a printed circuit board substrate;

a supply voltage plane layer supported by the printed circuit board substrate, the supply voltage plane layer to communicate a supply voltage; and

a ground plane supported by the printed circuit board substrate, the ground plane embedded in the supply voltage plane layer to provide ground connections to multiple pins of a component mounted to the printed circuit board,

wherein the ground connections are associated with electrical devices connected to the component.

10. The printed circuit of claim 9, further comprising:

a ground plane layer separate from the supply voltage plane layer.

12. The printed circuit board of claim 9, wherein the ground plane has an outer boundary established by the ground connections.

11. The printed circuit board of claim 11, wherein the ground plane lies substantially within a region located directly below the component, the component being mounted on top of a signal layer.

13. A method comprising:

for each high frequency component to be mounted on a printed circuit board, embedding an associated supply voltage plane in a signal layer of the printed circuit board to provide power to the component, the signal layer being used to communicate high frequency signals associated with the high frequency component or components; and

for each supply voltage plane embedded in the signal layer, embedding an associated ground plane in a supply voltage plane layer of the printed circuit board to provide ground connections for the component associated with said supply voltage plane embedded in the signal layer.

14. The method of claim 13, further comprising:

providing a core to support the signal layer and the supply voltage plane layer; and

locating the signal layer and the supply voltage plane layer on the same side of the core.

15. The method of claim 13, further comprising:

providing a ground plane layer on the opposite side of the core from said same side of the core; and

connecting the ground plane or planes embedded in the supply voltage plane layer to the ground plane layer.