Method for cleaning a process chamber
First Claim
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1. A method of cleaning a processing region of a deposition chamber, comprising:
- introducing a cleaning gas into a remote plasma source connected to the deposition chamber;
striking a plasma in the remote plasma source using a power of about 2 kilowatts or greater;
increasing the power applied by the remote plasma source to the struck plasma to between about 5 kilowatts and about 8 kilowatts, wherein the struck plasma comprises reactive species;
introducing helium into the processing region;
introducing the cleaning gas from the remote plasma source into the processing region; and
delivering radio frequency (RF) power to the processing region.
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Abstract
Methods and apparatus for cleaning deposition chambers are presented. The cleaning methods include the use of a remote plasma source to generate reactive species from a cleaning gas to clean deposition chambers. A flow of helium or argon may be used during chamber cleaning. Radio frequency power may also be used in combination with a remote plasma source to clean deposition chambers.
62 Citations
32 Claims
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1. A method of cleaning a processing region of a deposition chamber, comprising:
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introducing a cleaning gas into a remote plasma source connected to the deposition chamber;
striking a plasma in the remote plasma source using a power of about 2 kilowatts or greater;
increasing the power applied by the remote plasma source to the struck plasma to between about 5 kilowatts and about 8 kilowatts, wherein the struck plasma comprises reactive species;
introducing helium into the processing region;
introducing the cleaning gas from the remote plasma source into the processing region; and
delivering radio frequency (RF) power to the processing region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of cleaning a processing region of a deposition chamber, comprising:
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introducing a cleaning gas into a remote plasma source connected to the deposition chamber;
striking a plasma in the remote plasma source, wherein the struck plasma comprises reactive species;
introducing the cleaning gas from the remote plasma source into the processing region;
delivering radio frequency (RF) power to the processing region;
terminating the radio frequency power in the processing region, and flowing the cleaning gas from the remote plasma source into the processing region after terminating the radio frequency power. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 25, 26, 27, 28, 29, 30, 31)
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23. A method of cleaning a processing region of a deposition chamber, comprising:
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introducing a cleaning gas into a remote plasma source connected to the deposition chamber;
striking a plasma in the remote plasma source, wherein the plasma is struck using a cower of about 2 kilowatts or greater in the remote plasma source, the struck plasma comprises reactive species, and wherein the power applied by the remote plasma source to the struck plasma is increased to between about 5 kilowatts and about 8 kilowatts;
introducing the cleaning gas from the remote plasma source into the processing region;
delivering radio frequency (RF) power to the processing region; and
terminating the radio frequency power in the processing region. - View Dependent Claims (24)
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32. A method of cleaning a processing region of a deposition chamber, comprising:
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introducing an inert gas and a cleaning gas into a remote plasma source connected to the deposition chamber;
striking a plasma in the remote plasma source, wherein the struck plasma comprises reactive species, and the plasma is struck using a power of about 2 kilowatts or greater in the remote plasma source;
increasing the power applied by the remote plasma source to the struck plasma to between about 5 kilowatts and about 8 kilowatts;
introducing the cleaning gas from the remote plasma source into the processing region;
introducing helium into the processing region;
delivering radio frequency (RF) power to the processing region;
terminating the radio frequency power in the processing region;
terminating the flow of helium into the processing region; and
introducing argon into the processing region.
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Specification