Packaging microelectromechanical structures

• US 6,903,452 B2
• Filed: 08/19/2003
• Issued: 06/07/2005
• Est. Priority Date: 04/03/2002
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Heck, John, Wang, Li-Peng, Ma, Qing, Rao, Valluri, Tran, Quan
• Primary Examiner(s): Zarabian, Amir
• Assistant Examiner(s): BRYANT, KIESHA ROSE
• Application Number:
  US10/643,427
• Publication Number:
  US 20040051181A1
• Time in Patent Office: 658 Days
• Field of Search: 257/680, 257/724, 257/678, 257/778
• US Class Current: 257/680
• CPC Class Codes: B81B 7/0006 Interconnects
• CPC Class Codes: B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A microelectromechanical system may be enclosed in a hermetic cavity defined by joined, first and second semiconductor structures. The joined structures may be sealed by a solder sealing ring, which extends completely around the cavity. One of the semiconductor structures may have the system formed thereon and an open area may be formed underneath said system. That open area may be formed from the underside of the structure and may be closed by covering with a suitable film in one embodiment.

Claims

1. A device comprising:

a first semiconductor structure having front and back sides;

a microelectromechanical system formed on said front side of said first structure;

a second structure bonded to said first structure by a surface mount connection, said connection including a solder bump that defines a hermetic cavity between said first and second structures surrounding said system;

an open area in said first structure under said system; and

a film applied to the back side of said first semiconductor structure forming said open area between said first semiconductor structure and said film.

2. The device of claim 1 wherein said film is a plastic film.

3. The device of claim 2 wherein said film is adhesively secured to said back side.

4. The device of claim 1 wherein said first and second structures are semiconductor structures.

5. The device of claim 1 wherein said second structure is an insulator.

6. The device of claim 5 wherein said second structure is glass.

7. The device of claim 6 including an aperture through said second structure said aperture being filled by a solder bump that extends completing through said second structure.

8. The device of claim 1 wherein said system is a film bulk acoustic resonator.

9. The device of claim 1 wherein said system is a switch.

10. The system of claim 1 wherein said system is a transmission line.