Cooling device capable of reducing thickness of electronic apparatus

• US 6,909,604 B2
• Filed: 09/22/2003
• Issued: 06/21/2005
• Est. Priority Date: 09/17/2001
• Status: Active Grant

• Current Assignee: Fujitsu Client Computing Limited (Lenovo Group Ltd.)
• Original Assignee: Fujitsu Limited
• Inventors: Ohnishi, Masuo, Tanaka, Atsuko
• Primary Examiner(s): THOMPSON, GREGORY D
• Application Number:
  US10/664,933
• Publication Number:
  US 20040095725A1
• Time in Patent Office: 638 Days
• Field of Search: 622/592, 165/80.2, 165/80.3, 165/121, 165/122, 165/104.33, 174/15.2, 174/16.3, 361/690, 361/687, 361692-695, 361/697, 361/700, 361719-721, 454/186, 415175-178, 257/722
• US Class Current: 361/695
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• CPC Class Codes: H05K 1/0272 Adaptations for fluid transport, e.g. channels, holes
• CPC Class Codes: H05K 2201/064 Fluid cooling, e.g. by integral pipes
• CPC Class Codes: H05K 2201/09072 Hole or recess under component or special relationship between hole and component
• CPC Class Codes: H05K 2201/09772 Conductors directly under a component but not electrically connected to the component cooling of mounted components by printed thermal vias H05K1/0206
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components

Abstract

A fan housing of a fan unit includes a housing wall standing from the surface of a printed circuit board. The printed circuit board serves to establish the fan housing in cooperation with the housing wall. The fan housing further includes a ceiling wall connected to the housing wall. The ceiling wall extends along a datum plane parallel to the surface of the printed circuit board. A high speed airflow can be generated within the fan housing. The airflow promotes the heat radiation from the printed circuit board. An electrically conductive wiring pattern extending over the surface of the printed circuit board may further promote the heat radiation from the printed circuit board.

Claims

1. A printed circuit board unit with a cooling device, comprising:

a printed circuit board;

a ventilation fan coupled to the printed circuit board for relative rotation to the printed circuit board, said ventilation fan having a rotation axis and a direction of said rotation axis Intersecting the printed circuit board;

a housing wall standing from a surface of the printed circuit board at a periphery of the ventilation fan;

an outlet defined in the housing wall;

an electronic component mounted on the printed circuit board outside the housing wall; and

an electrically conductive wiring pattern extending over the surface of the printed circuit board inside the housing wall and connected to the electronic component.

2. The printed circuit board unit with the cooling device according to claim 1, further comprising a radiation fin connected to the electrically conductive wiring pattern.

3. The printed circuit board unit with the cooling device according to claim 1, wherein the electronic component is a central processing unit.

4. An electronic apparatus comprising:

a printed circuit board;

a ventilation fan coupled to the printed circuit board for relative rotation to the printed circuit board, said ventilation fan having a rotation axis and a direction of said rotation axis intersecting the printed circuit board;

a housing wall standing from a surface of the printed circuit board at a periphery of the ventilation fan;

an outlet defined in the housing wall;

an electronic component mounted on the printed circuit board outside the housing wall; and

an electrically conductive wiring pattern extending over the surface of the printed circuit board inside the housing wall and connected to the electronic component.

5. The electronic apparatus according to claim 4, further comprising a radiation fin connected to the electrically conductive wiring pattern.

6. The electronic apparatus according to claim 4, wherein the electronic component is a central processing unit.