Miniature 3-dimensional package for MEMS sensors

• US 6,918,297 B2
• Filed: 02/08/2003
• Issued: 07/19/2005
• Est. Priority Date: 02/28/2003
• Status: Expired due to Term

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: MacGugan, Douglas C.
• Primary Examiner(s): Nelms, David
• Assistant Examiner(s): Nguyen, Dao H.
• Application Number:
  US10/377,439
• Publication Number:
  US 20040169244A1
• Time in Patent Office: 892 Days
• Field of Search: 735/041.2, 735/041.5, 257/416, 257/678, 385/17, 385/18, 385/19
• US Class Current: 73/504.15
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 7/0074 3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
• CPC Class Codes: G01C 21/166 Mechanical, construction or arrangement details of inertial navigation systems
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: H01R 33/88 adapted for simultaneous co-operation with two or more identical counterparts

Abstract

An apparatus for mechanically mounting one or more Micro Electro-Mechanical System (MEMS) sensors on a stable, structurally sound base, the base being a generally cubical block formed in a ceramic substrate having a plurality of substantially planar and mutually orthogonal surfaces, wherein a first one of the surfaces is structured for rotationally interfacing with a host structure that is to be monitored; one or more of the remaining surfaces is structured for mechanically mounting of a MEMS sensor; and a plurality of electrical signal carriers communicate between each of the MEMS sensor mounting surfaces and a plurality of electrical interface contacts positioned on the interfacing surface.

Claims

1. An apparatus for mounting one or more Micro Electro-Mechanical System (MEMS) sensors, the apparatus comprising:

means for orthogonally orienting each of at least two different MEMS sensor mounting surfaces relative to a common interface surface, the common interface surface being formed on a unitary generally cubical block and the mounting surfaces being recessed within different external surface of the block;

means for routing electrical power, ground and operational signals between each sensor mounting surfaces and the common interface surface; and

means for rotationally interfacing the common interface surface with an external key mechanism.

2. The mounting apparatus of claim 1, further comprising means for mechanically securing the common interface surface to a host structure that is to be monitored.

3. The mounting apparatus of claim 1, further comprising a MEMS sensor mounted on each of the sensor mounting surfaces, each of the MEMS sensors being electrically coupled to the means for routing electrical power, ground and operational signals.

4. The mounting apparatus of claim 3, further comprising means for hermetically sealing one or more of the MEMS sensors within the block.

5. The mounting apparatus of claim 1 wherein the means for orthogonally orienting each of at least two different MEMS sensor mounting surfaces relative to a common interface surface further comprises means for orienting each of at least three MEMS sensor mounting surfaces relative to the common interface surface.

6. The mounting apparatus of claim 5, further comprising means for hermetically sealing each of the MEMS sensors within the block.

7. An apparatus for mechanically mounting one or more Micro Electro-Mechanical System (MEMS) sensors on a stable, structurally sound base, the base comprising:

a generally cubical block formed in a substrate having a plurality of substantially planar and mutually orthogonal surfaces;

a first one of the surfaces being structured for rotationally interfacing with a host structure that is to be monitored;

a plurality of the surfaces orthogonal to the interfacing surface each being formed with a recessed cavity having a sensor mounting surface formed therein, each of the recessed sensor mounting surfaces being structured for mechanically mounting of a MEMS sensor; and

a plurality of electrical signal carriers communicating between the each of the MEMS sensor mounting surfaces and a plurality of electrical interface contacts positioned on the interfacing surface.

8. The apparatus of claim 7 wherein the generally cubical block further comprises a ceramic block.

9. The apparatus of claim 7 wherein the first surface structured for rotationally interfacing with a host structure further comprises a structural key oriented diagonally to the surface.

10. The apparatus of claim 7 wherein the generally cubical block further comprises a generally cylindrical aperture communicating between the interfacing surface and a surface of the block opposite thereto.

11. The apparatus of claim 7,

further comprising a MEMS sensor being mounted to each of the MEMS sensor mounting surfaces and electrically interfaced to the electrical signal carriers.

12. The apparatus of claim 11 wherein each of the MEMS sensors further comprises a MEMS sensor packaged in a hermetically sealed leaded chip carrier (LCC).

13. The apparatus of claim 11,

further comprising a cover installed over each MEMS sensor and sealed to the surface of the block.

14. The apparatus of claim 13 wherein the seals between each of the covers and the block further comprises a hermetic seal.

15. A mounting apparatus for one or more Micro Electro-Mechanical System (MEMS) sensors, the apparatus comprising:

a generally cubical ceramic block having at least four mutually substantially orthogonal surfaces;

structure being formed in a first of the surfaces for mechanically interfacing with a host structure that is to be monitored;

structure being formed in each of a second, a third and a fourth of the surfaces for mounting a MEMS sensor within each of the respective second, third and fourth surfaces;

a structural key being formed in the first surface for rotationally interfacing with an external key mechanism; and

a plurality of electrical signal carriers communicating between the mounting structure in each of the second and third surfaces and a plurality of electrical interface contacts positioned on the first surface.

16. The mounting apparatus of claim 15, further comprising a cover hermetically sealed to the ceramic block and enclosing the MEMS sensor mounting structure in each of the respective second, third and fourth surfaces.

17. The mounting apparatus of claim 16 further comprising a single MEMS sensor mounted on each of the MEMS sensor mounting surfaces and electrically interfaced with the electrical signal carriers.

18. The mounting apparatus of claim 15 wherein the structure formed in the first one of the surfaces for mechanically mounting of a MEMS sensor further comprises a surface recessed in a face of the cubical block.

19. The mounting apparatus of claim 18 wherein the recessed surface further comprises a MEMS sensor mounting surface communicating with the interfacing surface along one mutually contiguous border.

20. The mounting apparatus of claim 15, further comprising structure for mechanically securing the ceramic block to the host structure.