Tamper-responding encapsulated enclosure having flexible protective mesh structure

• US 6,929,900 B2
• Filed: 11/07/2003
• Issued: 08/16/2005
• Est. Priority Date: 01/03/2001
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Szeparowycz, George, Shaw, Jane M., Weingart, Steve H., Feger, Claudius, Farquhar, Donald S., Poliks, Mark D., Markovich, Voya, Papathomas, Konstantinos I.
• Primary Examiner(s): Duda, Kathleen
• Application Number:
  US10/704,021
• Publication Number:
  US 20040195001A1
• Time in Patent Office: 648 Days
• Field of Search: 430/311, 430/312, 430/316, 427/96.1, 427/98.4
• US Class Current: 430/311
• CPC Class Codes: G06F 21/87 by means of encapsulation, e.g. for integrated circuits
• CPC Class Codes: H01L 23/57 Protection from inspection, reverse engineering or tampering
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0275 Security details, e.g. tampering prevention or detection
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 1/167 incorporating printed resistors
• CPC Class Codes: H05K 2201/0352 Differences between the conductors of different layers of a multilayer
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 2203/1572 Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Abstract

A structure and method for forming a tamper respondent electronic circuit enclosure that includes an integrated circuit structure, a mesh structure surrounding the integrated circuit structure, and a sealed enclosure surrounding the mesh structure. The mesh structure includes a layer of flexible dielectric having a first side and a second side, a screen-printed pattern of flexible electrically conductive first circuit lines forming a first resistor network on the first side, and a photo lithographically-formed pattern of flexible electrically conductive second circuit lines forming a second resistor network on the second side.

Claims

1. A method of manufacturing a tamper respondent electronic circuit article comprising:

screen printing a pattern of flexible electrically conductive first circuit lines forming a first resistor network on a first side of a flexible dielectric; and

photolithographically forming a pattern of flexible electrically conductive second circuit lines forming a second resistor network on a second side of said flexible dielectric.

2. The method in claim 1, wherein said first circuit lines are formed to appear interleaved with said second circuit lines when viewed from said first side or said second side.

3. The method in claim 1, wherein said screen printing of said first circuit lines comprises printing conductive ink lines.

4. The method in claim 1, wherein said photolithographically forming said second lines comprises forming metal lines.

5. The method in claim 1, further comprising applying an adhesive to said flexible dielectric.

6. The method in claim 1, wherein said first circuit lines are formed to have a different width than said second circuit lines.