Dissipative ceramic bonding tool tip

  • US 6,935,548 B2
  • Filed: 08/27/2003
  • Issued: 08/30/2005
  • Est. Priority Date: 02/25/1999
  • Status: Expired due to Term
First Claim
Patent Images

1. A device comprising:

  • a tip of a bonding tool having a dissipative material for use in wire bonding machines for connecting leads to integrated circuit bonding pads, wherein the tip has a static discharge time between 0.1 and 0.5 seconds.

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