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Attachment of organic molecules to group III, IV or V substrates

  • US 6,943,054 B2
  • Filed: 07/28/2003
  • Issued: 09/13/2005
  • Est. Priority Date: 07/25/2003
  • Status: Expired due to Fees
First Claim
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1. A method of covalently coupling an organic molecule to a surface of a Group III, IV, or V element or to a semiconductor comprising a Group III, IV, or V element, said method comprising:

  • providing a heat resistant organic molecule derivatized with an attachment group; and

    contacting the derivatized heat resistant organic molecule with a surface of said Group III, IV, or V element or semiconductor comprising a Group III, IV, or V element; and

    heating the surface to a temperature of at least about 200°

    C. whereby said attachment group forms a covalent bond with said surface.

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