Electronic component and method of manufacturing the same

• US 6,946,945 B2
• Filed: 10/01/2002
• Issued: 09/20/2005
• Est. Priority Date: 10/03/2001
• Status: Expired due to Fees

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Sato, Satoshi, Izumi, Yasuhiro, Kiyomura, Yoshihiro, Tabaru, Yasunori, Fujimaru, Takuya, Yoneda, Yoshito
• Primary Examiner(s): MAI, ANH T
• Application Number:
  US10/260,544
• Publication Number:
  US 20030079904A1
• Time in Patent Office: 1,085 Days
• Field of Search: 336/200, 336/223, 336/232, 336/83, 336/192, 296/021, 296/06
• US Class Current: 336/200
• CPC Class Codes: H01C 1/028 the resistive element being embedded in insulation with outer enclosing sheath
• CPC Class Codes: H01C 17/06 adapted for coating resistive material on a base
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 27/027 specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H01F 27/324 Insulation between coil and core, between different winding sections, around the coil; Other insulation structures
• CPC Class Codes: H01F 27/327 Encapsulating or impregnating encapsulating coil and core H01F27/022
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: H01G 4/06 Solid dielectrics
• CPC Class Codes: H01G 4/40 Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/49171 with encapsulating

Abstract

In an electronic component, an element section is formed on a base, and the element section has functions of at least one of inductance, resistor, and capacitor. Resist film is formed on at least the lateral faces of the base. An unnecessary part of patterned resist film is removed, and a protective member is formed on that removed place. Then remaining resist film is removed. This manufacturing method can provide the electronic component excellent in bonding strength between the protective member and the base.

Claims

1. An electronic component comprising:

a base;

a film provided to said base;

a groove formed on both of said base and said film;

a resin section provided in a recess formed on a bottom of said groove;

a protective member for covering said groove and being bonded to said resin section; and

a terminal section provided to both ends of said base and sandwiching said protective member.

2. The electronic component of claim 1, wherein said resin section and said protective member are made of resin material different from each other.

3. The electronic component of claim 1, wherein said resin section and said protective member are made of electrodeposited film.

4. The electronic component of claim 1, wherein said film comprises either a conductive film or a resistive film.

5. The electronic component of claim 1, wherein a material of said film is at least one material selected from the group consisting of gold, silver, copper, carbon, Ni—

Cr, ruthenium oxide and nickel.

6. The electronic component of claim 1, wherein a thickness of said protective member ranges from 10 to 25 μ

m.

7. The electronic component of claim 1, wherein said terminal section is a terminal electrode formed by laminating at least one of an anticorrosion film or a bonding film, or comprises a single layer thereof.

8. The electronic component of claim 1, wherein said protective member comprises an electrodeposited resin film.

9. The electronic component of claim 8, wherein said electrodeposited resin film comprises at least one resin selected from the group consisting of acrylic resin, epoxy resin, fluorine-based resin, urethane-based resin and polyimide-based resin.

10. The electronic component of claim 1, wherein said resin section comprises a resist film.

11. The electronic component of claim 10, wherein said resist film comprises either an energy beam curable resin or an energy degradation resin.

12. The electronic component of claim 10, wherein said resist film comprises either an epoxy resin or an acrylic resin.

13. The electronic component of claim 1, wherein said base is shaped like a polygonal pillar and the corners are chamfered.

14. The electronic component of claim 7, wherein said anticorrosion film comprises at least one metal selected from the group consisting of Ti, Ni, W and Cr.

15. The electronic component of claim 7, wherein said anticorrosion film comprises Ni—

Cr.

16. The electronic component of claim 7, wherein said bonding film comprises either a solder or a binding material free from Pb.

17. The electronic component of claim 7, wherein a surface of said terminal electrode protrudes from a surface of said protective member by at least 2 μ

m.