Multi-chip package having a contiguous heat spreader assembly

  • US 6,963,129 B1
  • Filed: 06/18/2003
  • Issued: 11/08/2005
  • Est. Priority Date: 06/18/2003
  • Status: Active Grant
First Claim
Patent Images

1. A heat spreader assembly, comprising:

  • a single, unibody heat spreader configured to extend across substantially the entire first surface of at least two spaced integrated circuits opposite a second surface of the integrated circuits having a bonding pad;

    adhesive placed between the heat spreader and the first surface for securing the heat spreader to the first surface of the integrated circuits at a spaced distance above at least one passive device arranged in the area between the spaced integrated circuits; and

    a second heat spreader interposed between the heat spreader and only of the at least two spaced integrated circuits.

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