High performance probe system

• US 6,965,244 B2
• Filed: 05/08/2002
• Issued: 11/15/2005
• Est. Priority Date: 05/08/2002
• Status: Expired due to Term

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Miller, Charles A.
• Primary Examiner(s): Pert, Evan
• Assistant Examiner(s): HOLLINGTON, JERMELE M
• Application Number:
  US10/142,548
• Publication Number:
  US 20040036493A1
• Time in Patent Office: 1,287 Days
• Field of Search: 324/754, 324756-758, 324760-762, 324/158.1, 361/772, 361/774, 361/776, 361/789, 438 14- 16
• US Class Current: 324/754.14
• CPC Class Codes: G01R 1/07314 the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support on an elastic support, e.g. a film, G01R1/0735
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 31/2889 Interfaces, e.g. between probe and tester G01R31/31905 and G01R1/07364 take precedence
• CPC Class Codes: G01R 31/31905 Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

A probe system for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs to be tested includes a probe board assembly, a flex cable and a set of probes arranged to contact the IC'"'"'s I/O pads. The probe board assembly includes one or more rigid substrate layers with traces and vias formed on or within the substrate layers providing relatively low bandwidth signal paths linking the tester to probes accessing some of the IC'"'"'s pads. The flex cable provides relatively high bandwidth signal paths linking the tester to probes accessing others of the IC'"'"'s pads.

Claims

1. An apparatus for providing signal paths between an integrated circuit (IC) tester and a plurality of IC pads on a surface of an IC to be tested, the apparatus comprising:

a substantially flexible substrate including a first signal path conductively linked to a first point on the flexible substrate;

a conductive first probe for contacting the first point on the flexible substrate and for contacting a first IC pad of the plurality of IC pads;

a rigid substrate including an electrical path for linking the IC tester to the first signal path of the flexible substrate; and

a first structural member for attaching to a second probe on the flexible substrate so as to substantially inhibit freedom of movement of the second probe relative to the rigid substrate.

2. The apparatus in accordance with claim 1 wherein the first probe comprises a spring contact.

3. The apparatus in accordance with claim 1 wherein the first probe is attached to said first point and includes a tip for contacting the first IC pad.

4. The apparatus in accordance with claim 1 wherein the first probe is attached to the first IC pad and includes a tip for contacting the first point.

5. The apparatus in accordance with claim 4 wherein the first probe comprises a spring contact.

6. The apparatus in accordance with claim 1 wherein:

the second probe extends between the flexible substrate and a second IC pad of the plurality of IC pads.

7. The apparatus in accordance with claim 6 wherein the second probe comprises a spring contact.

8. The apparatus in accordance with claim 6 wherein the first structural member comprises a flexible cable for conductively linking the second probe to said IC tester.

9. The apparatus in accordance with claim 6 wherein the first structural member comprises means for conductively linking the second probe to the IC tester.

10. The apparatus in accordance with claim 1 further comprising:

a conductive contact extending from the first structural member to contact a second IC pad of the plurality of IC pads, wherein the first structural member;

conductively links said conductive contact to connect to the IC tester.

11. The apparatus in accordance with claim 10 further comprising means for conductively linking the conductive contact to the second probe, wherein the second probe is linked through a conductive path separate from the structural member to the IC tester, the conductive path provided vertically through the flexible substrate and through the rigid substrate.

12. The apparatus in accordance with claim 10 wherein the conductive contact comprises a spring contact.

13. The apparatus in accordance with claim 12

wherein the flexible substrate has opposing surfaces,

wherein the third point and the fourth point are on separate ones of the opposing surfaces, and

wherein the means for conductively linking said third and fourth points comprises a via passing through the flexible substrate between the opposing surfaces.

14. The apparatus in accordance with claim 1 wherein said flexible substrate comprises:

a flexible substrate expanse having an aperture therein,

a first substrate island residing in the aperture, the first point and the second point residing on said first substrate island, and

at least one flexible first substrate bridge linking the first substrate island to the flexible substrate expanse, said first signal path extends through said at least one first substrate bridge.

15. The apparatus in accordance with claim 14 wherein the first probe comprises a flexible spring contact.

16. The apparatus in accordance with claim 15 wherein the first structural member rigidly bonds the second point to the rigid substrate.

17. The apparatus in accordance with claim 14 further comprising:

a conductive second probe for contacting a third point on the flexible substrate and for contacting a second IC pad of the plurality of IC pads, said rigid substrate being structurally linked to a fourth point on the flexible substrate proximate to the third point so as to substantially inhibit freedom of movement of the third point relative to the rigid substrate,

means for conductively linking the third and fourth points,

a second conductive structural member extending between the fourth point and the rigid substrate and substantially limiting movement of the fourth point relative to the rigid substrate, and

means including a conductor formed on the rigid substrate for providing a conductive signal path between the second conductive structural member and the IC tester.

18. The apparatus in accordance with claim 17 wherein the flexible substrate expanse has a second aperture therein and further comprises:

a second substrate island residing in the second aperture, the third point and the fourth point residing on said substrate island, and

at least one flexible second substrate bridge linking the second substrate island to the flexible substrate expanse.

19. The apparatus in accordance with claim 14 wherein the first structural member comprises a flexible spring contact.

20. The apparatus in accordance with claim 19 wherein the first probe comprises a substantially rigid tip attached to the first point for contacting the first IC pad.

21. The apparatus in accordance with claim 20

wherein the first and second structural members comprise flexible spring contacts, and

wherein the first and the second probes comprise substantially rigid tips attached to the first and third points, respectively, for contacting the first and second IC pads, respectively.

22. The apparatus in accordance with claim 20

wherein the first and second structural members rigidly bond the second and fourth points to the rigid substrate, and

wherein the first and the second probes comprise flexible spring contacts.

23. An apparatus for providing signal paths between an integrated circuit (IC) tester and a plurality of IC pads on a surface of an IC to be tested, the apparatus comprising:

a rigid substrate;

a substantially flexible substrate including a conductive first probe extending between the flexible substrate and a first IC pad of the plurality of pads and a first path for connecting to the first probe; and

a structural member attached to an end portion of the flexible substrate and to the rigid substrate to substantially inhibit freedom of movement of the end portion relative to the rigid substrate, the structural member providing a conductive link between the first signal path and the IC tester.

24. The apparatus in accordance with claim 23 wherein the structural member further comprises:

a flexible substrate finger attached to the end portion of the flexible substrate on a same surface of the flexible substrate as the first probe.

25. The apparatus in accordance with claim 23 wherein the conductive link between the first signal path and the first probe comprises a flexible cable attaching the flexible substrate to the rigid substrate.

26. The apparatus in accordance with claim 23 further comprising:

a conductive second probe extending between the rigid substrate and a second IC pad of the plurality of IC pads; and

means for conductively linking the second probe to the IC tester including a conductor passing though the rigid substrate.

27. The apparatus in accordance with claim 23 wherein the means for conductively linking the first signal path to the first probe comprises conductive means extending from the first signal path through a point of attachment of the end portion of the flexible substrate and the rigid substrate, and through the rigid substrate to the first probe.

28. The apparatus in accordance with claim 27 further comprising:

a conductive second probe extending between the rigid substrate and a second IC pad of the plurality of IC pads; and

means for conductively linking the second probe to the IC tester including a conductor passing though the rigid substrate.

29. The apparatus in accordance with claim 28 wherein the first probe comprises a flexible first spring contact and the second probe comprises a flexible second spring contact.

30. An apparatus for providing signal paths between test equipment and a first integrated circuit (IC) pad and first IC pad on an IC to be tested, the apparatus comprising:

a probe board assembly comprising at least a first substrate layer and a second substrate layer and a first signal path through the probe board assembly, wherein;

the first substrate layer includes a first contact and a second contact, the first contact linking the IC pad to the first signal path, and the second contact connecting to a second signal path the second signal path provided around at least one of the substrate layers of the probe board assembly.

31. The apparatus in accordance with claim 30 wherein the first contact comprises a spring contact attached to the probe board assembly and having a tip for contacting the first IC pad.

32. The apparatus in accordance with claim 30 wherein the first contact comprises a spring contact attached to the first IC pad and having a tip for contacting the probe board assembly.

33. The apparatus in accordance with claim 30 wherein the apparatus further comprises at least one flexible structural member attached between the first substrate and said IC to be tested.

34. The apparatus in accordance with claim 30 wherein said at least one substrate layer comprises material having a coefficient of thermal expansion substantially similar to a coefficient of thermal expansion of said at least one IC.

35. The apparatus in accordance with claim 30 wherein the probe board assembly further comprises an interposer with spring contacts connecting the first and second layers, wherein the second signal path is provided around the interposer, and the first signal path is provided through the interposer.

36. The apparatus in accordance with claim 30 wherein said second signal path comprises a coaxial cable.

37. The apparatus in accordance with claim 30 wherein the first signal path has a frequency response of a Butterworth filter.

38. The apparatus in accordance with claim 30 wherein the first signal path has a frequency response of a Chebyshev filter.

39. The apparatus in accordance with claim 30

wherein the first signal path comprises a first pogo pin connector linking the first contact to the IC test equipment, and

wherein the second signal path comprises a second pogo pin connector linking the second contact to the IC test equipment.

40. The apparatus in accordance with claim 30 wherein the second contact comprises a conductive tip formed on a surface of the flexible substrate and conductively linked to the second signal path.

41. The apparatus in accordance with claim 30 wherein the second signal path conveys a high frequency signal with less noise than the first signal path.

42. The apparatus in accordance with claim 30 wherein the first signal path is provided vertically through the first substrate from the first contact, at substantially a right angle to the second path as provided from the second contact.

43. The apparatus in accordance with claim 30 wherein the first signal path comprises a coaxial conductor.

44. The apparatus in accordance with claim 30 wherein said second signal path has a path impedance substantially uniformly distributed throughout its length.

45. The apparatus in accordance with claim 44 wherein said first signal path provides a path impedance that is other than substantially uniformly distributed throughout its length.

46. The apparatus in accordance with claim 44 wherein the first signal path comprises a plurality of substantially differing kinds of transmission lines connected in series, and

wherein the plurality of transmission lines have substantially similar characteristics impedances.

47. The apparatus in accordance with claim 30

wherein said at least one substrate layer comprises:

an interface board forming the second substrate layer having a surface defining a first plane;

a space transformer forming the first substrate layer having a surface defining a second plane;

an interposer substrate layer residing between the interface board substrate layer and the space transformer substrate layer, and

wherein said first signal path extends through said first and second planes and includes vias extending within each substrate layer and at least one conductive trace formed on or within at least one of the substrate layers.

48. The apparatus in accordance with claim 47

wherein the interface board, space transformer and interposer substrate layers are spaced apart and

wherein said first signal paths further comprise spring contacts extending between the interface board and interposer substrate layers and between the interposer and space transformer substrate layers.

49. The apparatus in accordance with claim 47

wherein the interface board substrate layer includes an aperture, and

wherein the space transformer substrate includes an end having a conductive element attached, the conductive element extending from the first substrate through the aperture.

50. The apparatus in accordance with claim 49 wherein the interface board substrate further comprises:

a pogo pin connector providing a pogo pin contacting the second signal path on the end of the flexible substrate extending through the aperture, for conductively linking said second signal path to the test equipment.

51. The apparatus in accordance with claim 47

wherein the second signal path terminates on the interface board substrate layer, and

wherein the second means comprises:

a conductive pad formed on the interface board layer and residing in the first plane, and

a conductive path passing through the interface board layer and linking the conductive pad to the second signal path.

52. The apparatus in accordance with claim 51 wherein the second means further comprises a pogo pin connector for linking the conductive pad to the IC test equipment.