Treatment method of film quality for the manufacture of substrates
First Claim
1. A method of fabricating substrates, the method comprising:
- providing a substrate comprising a film of material characterized by a non-uniform surface, the non-uniform surface including a plurality of defects, at least some of the defects being of a size ranging from about 100 Angstroms and greater; and
applying a combination of a deposition species for deposition of a deposition material and an etching species for etching an etchable material during a portion of time that the non-uniform surface is subjected to the etching, the combination of the deposition species and the etching species contacting the non-uniform surface in a thermal setting to reduce a level of non-uniformity of the non-uniform surface by filling a portion of the defects to smooth the film of material, the film of material being substantially free from the defects and being characterized by a surface roughness of a predetermined value.
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Abstract
A method of fabricating substrates, e.g., bulk wafers, silicon on insulator wafers, silicon on saphire, optoelectronic substrates. The method includes providing a substrate (e.g., silicon, gallium arsenide, gallium nitride, quartz). The substrate has a film characterized by a non-uniform surface, which includes a plurality of defects. At least some of the defects are of a size ranging from about 100 Angstroms and greater. The method also includes applying a combination of a deposition species for deposition of a deposition material and an etching species for etching etchable material. The combination of the deposition species and the etching species contact the non-uniform surface in a thermal setting to reduce a level of non-uniformity of the non-uniform surface by filling a portion of the defects to smooth the film of material. The smoothed film of material is substantially free from the defects and is characterized by a surface roughness of a predetermined value.
134 Citations
23 Claims
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1. A method of fabricating substrates, the method comprising:
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providing a substrate comprising a film of material characterized by a non-uniform surface, the non-uniform surface including a plurality of defects, at least some of the defects being of a size ranging from about 100 Angstroms and greater; and applying a combination of a deposition species for deposition of a deposition material and an etching species for etching an etchable material during a portion of time that the non-uniform surface is subjected to the etching, the combination of the deposition species and the etching species contacting the non-uniform surface in a thermal setting to reduce a level of non-uniformity of the non-uniform surface by filling a portion of the defects to smooth the film of material, the film of material being substantially free from the defects and being characterized by a surface roughness of a predetermined value. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 23)
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20. A method of fabricating substrates, the method comprising
providing a substrate comprising a film of material with a non-uniform surface, the non-uniform surface including a plurality of defects, at least some of the defects being 100 Angstroms or greater; - and
applying simultaneously to the non-uniform surface in a thermal setting a combination of a silicon-containing-deposition species for deposition of a deposition material and a halogen-containing-etching species for etching an etchable material in order to smooth the surface. - View Dependent Claims (21)
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22. A method of fabricating substrates, the method comprising
providing a silicon substrate comprising a film of material with a non-uniform surface, the non-uniform surface including a plurality of defects, at least some of the defects being 100 Angstroms or greater, the silicon substrate having a single crystal orientation, the non-uniform surface including particles derived from hydrogen gas during an implantation process; - and
applying simultaneously to the non-uniform surface a combination of a silicon-containing-deposition species for deposition of a deposition material and a halogen-containing-etching species for etching an etchable material in order to smooth and reduce a level of non-uniformity of the non-uniform surface, the halogen-containing-etching species including HCl, wherein the combination of the deposition species and the etching species are contacting the non-uniform surface placed in a thermal setting of a temperature of about 1,000 degrees Celsius or greater.
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Specification