Methods for conformal coating and sealing microchip reservoir devices

• US 6,973,718 B2
• Filed: 05/30/2002
• Issued: 12/13/2005
• Est. Priority Date: 05/30/2001
• Status: Expired due to Fees

• Current Assignee: MicroCHIPS Inc.
• Original Assignee: MicroCHIPS Inc.
• Inventors: Sheppard, Norman F. Jr., Feakes, Christina M.
• Primary Examiner(s): CHANG, RICK KILTAE
• Application Number:
  US10/158,811
• Publication Number:
  US 20020187260A1
• Time in Patent Office: 1,293 Days
• Field of Search: 298/41, 298/42, 298/43
• US Class Current: 29/846
• CPC Class Codes: A61K 9/0009 involving or responsive to electricity, magnetism or acoustic waves; Galenical aspects of sonophoresis, iontophoresis, electroporation or electroosmosis microelectromechanical systems A61K9/0097
• CPC Class Codes: A61K 9/0097 Micromachined devices; Microelectromechanical systems [MEMS]; Devices obtained by lithographic treatment of silicon; Devices comprising chips intradermal microneedle arrays A61K9/0021; MEMS in general B81B7/02
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

Methods are provided for conformally coating microchip devices and for sealing reservoirs containing molecules or devices in a microchip device. One method comprises (i) providing a substrate having a plurality of reservoirs having reservoir openings in need of sealing; (ii) loading reservoir contents comprising molecules, a secondary device, or both, into the reservoirs; and (iii) applying a conformal coating barrier layer, such as a vapor depositable polymeric material, e.g., parylene, onto the reservoir contents over at least the reservoir openings to seal the reservoir openings. Another method comprises vapor depositing a conformal coating material onto a microchip device having at least two reservoirs and reservoir caps positioned over molecules or devices stored in the reservoirs, and providing that the conformal coating does not coat or is removed from the reservoir caps.

Claims

1. A method for sealing reservoirs containing molecules or devices in a microchip device, the method comprising:

providing a substrate having a plurality of reservoirs, a front side, and a back side, the back side comprising a plurality of reservoir openings distal reservoir caps on the front side and in need of scaling;

loading reservoir contents comprising molecules, a secondary device, or both, into the reservoirs;

applying a buffering material over the reservoir contents in the reservoirs, the buffering material being discontinuous between the reservoirs; and

applying a conformal coating barrier layer onto the buffering material, wherein the conformal coating barrier layer is applied by vapor deposition, plating, spin coating, or multi-laminate coating.

2. The method of claim 1, further comprising removing the conformal coating from the reservoir caps.

3. The method of claim 2, wherein the removal is by chemical or plasma etching or by laser.

4. The method of claim 1, wherein the conformal coating is a uniform, bubble-free, pinhole-free coating.

5. The method of claim 1, wherein the conformal coating barrier layer comprises parylene.

6. The method of claim 1, wherein the conformal coating comprises a material selected from the group consisting of acrylics, polyurethanes, silicones, and combinations thereof.

7. The method of claim 1, wherein the buffering material comprises a wax or polymer.

8. The method of claim 1, wherein the reservoirs contents comprises drug molecules for controlled release.

9. The method of claim 1, wherein the reservoirs contents comprises a sensor or sensing component.

10. The method of claim 9, wherein the reservoir contents comprises a biosensor.

11. The method of claim 1, wherein the conformal coating barrier layer comprises a polymer and a metal.

12. The method of claim 1, wherein the conformal coating barrier layer has a thickness between 0.1 and 50 microns.