Flexible microchip devices for ophthalmic and other applications

• US 6,976,982 B2
• Filed: 01/09/2002
• Issued: 12/20/2005
• Est. Priority Date: 01/09/2001
• Status: Expired due to Fees

• Current Assignee: Microchips Biotech, Inc. (Keratin Biosciences, Inc.)
• Original Assignee: MicroCHIPS Inc.
• Inventors: Ausiello, Dennis, Cima, Michael J., Santini, John T. Jr., Sheppard, Norman F. Jr., Langer, Robert S., Herman, Stephen J.
• Primary Examiner(s): Lucchesi, Nicholas D.
• Assistant Examiner(s): Han, Mark K.
• Application Number:
  US10/042,996
• Publication Number:
  US 20020099359A1
• Time in Patent Office: 1,441 Days
• Field of Search: 604/65, 604/66, 604/131, 604/890.1, 604/891.1, 600/347, 600/348, 600/365
• US Class Current: 604/891.1
• CPC Class Codes: A61F 9/0017 implantable in, or in contact with, the eye, e.g. ocular inserts
• CPC Class Codes: A61K 9/0009 involving or responsive to electricity, magnetism or acoustic waves; Galenical aspects of sonophoresis, iontophoresis, electroporation or electroosmosis microelectromechanical systems A61K9/0097
• CPC Class Codes: A61K 9/0048 Eye, e.g. artificial tears
• CPC Class Codes: A61K 9/0051 Ocular inserts, ocular implants
• CPC Class Codes: A61K 9/0097 Micromachined devices; Microelectromechanical systems [MEMS]; Devices obtained by lithographic treatment of silicon; Devices comprising chips intradermal microneedle arrays A61K9/0021; MEMS in general B81B7/02
• CPC Class Codes: A61P 9/10 for treating ischaemic or atherosclerotic diseases, e.g. antianginal drugs, coronary vasodilators, drugs for myocardial infarction, retinopathy, cerebrovascula insufficiency, renal arteriosclerosis
• CPC Class Codes: H01L 24/96 the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01011 Sodium [Na]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01075 Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/12043 : Photo diode
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19043 : being a resistor

Abstract

Microchip device arrays that can conform to a curved surface are provided for the controlled release or exposure of reservoir contents. The arrays comprise two or more microchip device elements, each of which includes a plurality of reservoirs that contain molecules for controlled release or components for selective exposure, and a means for flexibly connecting the device elements. The reservoirs can contain one or more drugs and/or one or more secondary devices, such as a sensor or a component thereof. Preferably, the microchip devices contain and controllably release therapeutic, prophylactic, and diagnostic molecules to and into the eye of a patient in need thereof.

Claims

1. A microchip device array for the controlled release or exposure of reservoir contents comprising:

two or more microchip device elements, each of which includes a plurality of reservoirs which contain molecules for controlled release or components for selective exposure; and

a means for flexibly connecting said device elements, so as to form a flexible array which can conform to a curved surface.

2. The microchip device array of claim 1, wherein the means for flexibly connecting comprises a flexible supporting layer attached to a surface of the device elements.

3. The microchip device array of claim 2, wherein the flexible supporting layer comprises a polymer.

4. The microchip device array of claim 3, wherein the polymer is selected from the group consisting of polyimides, polyesters, parylenes, and hydrogels.

5. The microchip device array of claim 2, wherein the flexible supporting layer is porous or permeable to molecules releasable from the reservoirs or provided with one or more apertures through said flexible supporting layer.

6. The microchip device array of claim 1, wherein the means for flexibly connecting comprises one or more hinges or flexible tethers connecting two or more of the device elements.

7. The microchip device array of claim 1 for implantation onto or into a patient, wherein the array can conform to the curvature of a tissue surface.

8. The microchip device array of claim 7 for implantation into or onto the eye of the patient, wherein the tissue surface comprises ophthalmic tissue.

9. The microchip device array of claim 7, wherein the tissue surface is selected from the group consisting of the stratum comeum, mucosal membranes, blood vessels, bone, brain, and bladder.

10. The microchip device array of claim 1, wherein the microchip device elements further comprise a plurality of discrete reservoir caps over the molecules in the reservoirs, wherein each reservoir cap controls release of the molecules from one of the reservoirs.

11. The microchip device array of claim 1 further comprising a means for wirelessly communicating with the microchip device elements.

12. The microchip device array of claim 11, wherein the communicating means comprises a photocell to receive incident light energy.

13. The microchip device array of claim 1 further comprising an energy storage means.

14. The microchip device array of claim 13, wherein the energy storage means comprises a capacitor, a battery, or both.

15. The microchip device array of claim 1 further comprising electrical connections between two or more of the microchip device elements, such that the microchip device elements can be powered or controlled by a common energy source or control source, respectively.

16. The microchip device array of claim 1, wherein the reservoirs contain drug molecules.

17. The microchip device array of claim 1, wherein the reservoirs contains one or more secondary devices for exposure.

18. The microchip device array of claim 17, wherein the secondary device comprises a sensor.

19. The microchip device array of claim 18, wherein the sensor is a pressure sensor or a chemical sensor.

20. The microchip device array of claim 1, wherein the microchip device elements comprise reservoirs which contain drug molecules and at least one reservoir which contains a sensor.

21. The microchip device array of claim 1, wherein the reservoirs contain molecules selected from the group consisting of diagnostic reagents, catalysts, combinatorial chemistry precursors, and fragrance molecules.

22. The microchip device array of claim 1, wherein the electrical traces are built into the means for flexibly connecting said device elements.

23. The microchip device array of claim 1, which comprises flexible, passive release device elements.

24. The microchip device array of claim 7, which enhances the patency of a tissue lumen or other organ structure in the patient.